Every chip powering modern technology originates from a near-perfect silicon wafer. The creation of these wafers requires an exacting manufacturing process that blends cutting-edge technology with meticulous craftsmanship. SUMCO, a leader in wafer production, transforms single-crystal silicon ingots into the fundamental building blocks of semiconductor manufacturing through five critical stages.

The journey begins with cutting single-crystal silicon ingots—a process demanding extraordinary precision. SUMCO first performs diameter grinding to ensure uniform dimensions before employing either inner-diameter saws or wire cutting technology to slice the ingot into approximately 1mm-thick wafers. This seemingly simple operation actually requires sophisticated techniques, as cutting accuracy directly affects wafer thickness uniformity and surface quality—factors that ultimately determine chip performance.

Freshly cut wafers bear microscopic imperfections from the cutting process. SUMCO's grinding machines use aluminum oxide abrasives to polish surfaces to exact specifications while improving parallelism. The critical challenge lies in balancing grinding pressure and speed to avoid introducing new defects. Through decades of experience and advanced control systems, SUMCO achieves remarkable consistency in this foundational step.

Even after grinding, invisible mechanical stress remains in the silicon crystal structure. SUMCO's chemical etching process dissolves this damaged surface layer using precisely formulated reagents. This delicate operation requires exact control over etching rate and uniformity—too aggressive risks over-etching, while insufficient treatment leaves residual defects. SUMCO's proprietary chemical formulations and process controls ensure complete defect removal while maintaining material integrity.

To meet semiconductor manufacturing's extreme surface requirements, SUMCO employs chemical-mechanical planarization (CMP) technology. This advanced polishing technique combines colloidal silica abrasives with chemical and mechanical action to create surfaces with nanometer-scale flatness. The precisely controlled interplay of polishing slurry composition, pressure, and speed produces mirror-finish wafers that serve as ideal substrates for chip fabrication.

Before shipment, each wafer undergoes comprehensive cleaning and inspection. SUMCO's state-of-the-art detection systems evaluate surface defects, particulate contamination, resistivity, and other critical parameters. Only wafers meeting exacting standards proceed to customers—a quality commitment that has established SUMCO as a trusted partner for semiconductor manufacturers worldwide.

SUMCO's wafers represent more than just semiconductor substrates; they enable technological progress through continuous innovation in materials science and manufacturing excellence. By maintaining leadership in wafer production technology and quality control, SUMCO supports the advancement of global electronics manufacturing.