Cases

Industry characteristics and process requirements of Mini-LED packaging curing:   LED (semiconductor light-emitting diode) packaging refers to the packaging of light-emitting chips, which has a great difference, compared with integrated circuit packaging. The packaging of LED is not only required to protect the wick, but also to be able to transmit light. Therefore, the PACKAGING of LED not only has special requirements for packaging materials, but also has higher requirements for packaging curing equipment.   Mini LED is a sub-millimeter light-emitting diode, which the chip size is between 50 and 200μm. Mini LED is developed to solve the problem that the light granularity of traditional LED partition control is not fine enough. The luminous crystal is smaller, the number of crystals can be embedded in the backlight panel per unit area is more, and more backlight beads can be integrated on the same screen.   Mini LED chip is filled with glue, the chip and bracket are wrapped with glue, and then baking for long time and solidified by glue. The solidification process of the glue directly determines the final quality of Mini LED brightness and electrical parameters.   Suneast technology multi-channel tunnel oven solution:   Due to the small size, large quantity and high requirements of Mini LED, the packaging curing of Mini LED is especially suitable for using Suneast Technology multi-channel tunnel oven. The production efficiency of Suneast multi-channel tunnel oven is high; especially for long baking time requirement, which can effectively improve productivity and segmented temperature control to adapt to different product processes. The temperature uniformity is good and the quality is stable.   Suneast technology multi-channel tunnel oven adopts modular design concept, easy to operate, convenient and fast maintenance, reduce handling, save labor costs for customers; Low cost operation design, compared with the normal oven, energy saving 50%, to save the use of cost for customers; Multi-channel rail chain transmission, compared with the traditional oven, it belongs to the high output, to meet customer capacity demand; It can be used with automatic assembly line to effectively control manpower and improve product quality.     Suneast technology multi-channel tunnel oven has the following characteristics for Mini LED chip packaging curing:   1. Multi-channel rail chain transmission, high production efficiency, especially for the product which requires long time baking time, it can effectively improve productivity;   2. High-power motor, high thermal efficiency, heating box hot air internal circulation, the energy saving rate is more than 50% than traditional oven;   3. Segmented temperature control, in order to adapt to product process changes, good temperature uniformity, stable quality;   4. It can be used with automatic production line to effectively control manpower, reduce handling time and save input cost.   5. The inlet and outlet buffering use roller transmission;   6. High efficiency heating tube, long service life, drawer type design which is easy to replace;   7. Patented air duct structure design (patent No. : 201721160420.1), efficient heating module, front and back air circulation, better temperature uniformity, higher thermal efficiency;   8. The furnace opening design use electric cylinder support, and the whole furnace opening is on one side;   9. Modular segmented design, convenient disassembly;   10. Powerful and high stability control system  

       The characteristics of new energy automobile industry and its product process requirements:   　　New energy automobile refers to the vehicles that adopt unconventional vehicle fuel as a power source(or use conventional vehicle fuel and adopt new vehicle power devices),it integrates the advanced technology of vehicle power control and drive,and forms the vehicles with advanced technical principles,new technology and new structure.   　　The core technology of new energy vehicles is the"three electric",that is,battery,electric drive and electronic control.And the most core is the electronic control module.     　　The electronic control system should have high control precision,high dynamic response speed,and provide high safety and reliability.This requires that the electric control board not only has reliable welding quality,but also can withstand high frequency vibration and wet environment after installation and fixed.   　　The electronic control module is filled with glue,wrapped with glue,and then baked to allow the glue to solidify,which can effectively cope with vibration,humidity and other harsh conditions.The quality of the glue curing process directly affects the quality of the electric control system and the final quality of the control parameters.   　　（Electric control module for heating and curing in tunnel oven after filling glue）   　　As shown in the picture above;   　　Specific process requirements:the weight of a single product is up to 75Kg,the length,width and height are up to 500mm,the curing temperature is 105℃,the curing time is 20mins,and the temperature uniformity is±5℃.Productivity requirement:1min/pcs.     　　Suneast Tunnel Oven Configuration   　　Suneast tunnel oven’s characteristics for the packaging and curing of the electric control system of new energy automobiles:   　　1,The equipment adopts online conveying,which can be used with automatic production line,effectively control manpower input.   　　2,Equip with heavy-duty industrial roller conveyor chain+high-power motor,effectively cope with high load conveying requirements.   　　3.The heating section adopts modular design,which can flexibly design the length of the heating section according to the requirements of production capacity,so as to meet the needs of various processes.   　　4,The heating module adopts high efficiency heating tubes,with long service life,drawer type module,easy to remove and replace.   　　5.Patented air flow structure design(patent No.:201721160420.1),efficient heating module,back and forth air circulation mode,better temperature uniformity,higher thermal efficiency,which can effectively ensure curing quality.   　　6,The heating chamber adopts the heating module modular design,which is easy to remove and open,convenient equipment maintenance and abnormal handling.   　　7,The equipment adopts PC+PLC control mode,friendly man-machine interface,easy to operate and use,and it can be flexibly configured for various functions,such as MES,barcode scanner and so on.   　　After years of technical accumulation,Suneast tunnel oven has been widely used in automotive electronics,semiconductor industry,the related component packaging process,including electronics,motor,communication and other industries.

Curing characteristics and process requirements for back-end packaging of mobile phone chips:   Mobile phone is an electronic product that modern people cannot separate from it, which is used for communication, consumption, transportation, work and so on. The screen of mobile phone is getting bigger and bigger, but its core "chip" is getting thinner and smaller, which puts forward extremely stringent requirements for the back-end packaging and curing of mobile phone chip. The traditional curing process and equipment cannot meet the high quality, high yield and high efficiency of cell phone chip curing.     Suneast Technology online vertical curing oven solution:　　 Due to its small size, large quantity and high requirements, our vertical curing oven is especially suitable for mobile phone production line. 　　 Suneast online vertical oven, with compact structure, small footprint, it saves workshop space greatly; high production efficiency, much higher than the traditional curing oven, especially for products requiring long baking time in the oven, it can effectively improve production capacity, the market demand for vertical oven is increasing, replacing the traditional curing oven, has become a trend.　 Suneast online vertical oven adopts double lifting design, large number of storage boards and accurate temperature control can meet the requirements of various temperature profiles curing process.     Suneast Vertical oven has the following characteristics for the packaging curing of the back end of mobile phone chips:   1. Double lifting design for transmission system, large number of storage boards, can meet the high efficiency of production requirements.   2. Imported optical fiber sensor is adopted for board conveying detection in the chamber to ensure operation reliability to be maximum.   3. There’re 12 heating modules in the front and rear sides with high thermal compensation efficiency; each module can independently control the temperature and monitor the temperature change in real time to ensure that the temperature deviation in the oven is ≤±2℃.   4. Equipped with standard SMEMA communication interface, connected to the previous and next computers, automatic control of the board.   5. The push board mechanism adopts high precision stepping motor control, to ensure the accuracy of board pushing.   6. The top of the machine is equipped with an opening for fast air exhausting and cooling, which can quickly cool the temperature in the oven; if the equipment is abnormal, so as to facilitate inspection; the exhaust air outlet is equipped also to keep the air in the furnace clean.   7. Glass Windows are installed on the inlet side and outlet side of the equipment to facilitate real-time observation of the operating conditions in the oven.   8. Suneast online vertical oven is not only suitable for the packaging and curing of the back end of mobile phone chips, but also used in the production of chip bonding, bottom filling, component packaging and other hot curing processes.  

Automotive electronics industry product characteristics and selective soldering process requirements: Automotive boards are different from normal PCB, thick copper is the basic feature, metal base, and also ceramic base (for heat dissipation and high current, and even buried copper blocks). The temperature and current of the car board are higher than normal PCB.   Suneast Selective soldering equipment solution: For the welding of automobile board components, it is small, high quality of solder joint and free cleaning. The free cleaning flux is selected when the flux is sprayed, by controlling the flux spraying volume, the flux can be saved about 95% and ensuring good spraying effect. The preheating module adopts segmented control and automatic temperature correction function, which can not only meet the high temperature required by the car board, but also save the power consumption of the equipment. The electromagnetic pump of solder pot can provide stable high wave, welding the solder joints and ensure high quality.     Suneast selective soldering machine for automotive board welding has the following characteristics: 1. Use small solder pot with electromagnetic pump, high wave, large flow, stable wave, deep penetration in solder points, strong infiltration and welding; 2. Nitrogen filling protection is around the nozzle and solder surface, which can improve the solderability of lead-free solder, and reduce the production of solder dross to prevent nozzle block, save welding costs and labor costs; 3. High temperature resistance, corrosion resistance, special nozzle, strong oxidation resistance, good infiltrating, and the using time is up to 3 months. 4. Automatic detection of solder level height, to ensure the stability of wave. 5. Thin solder joint. 6. Equipped with two CCD cameras which are used to monitor the welding status and PCB positioning programming. 7. Equipped with stop positioning device in the spray and welding transmission track, to ensure spray and welding accuracy. 8. The welding conveying adopts roller design, effectively prevent high temperature deformation, PCB processing edge width is much bigger than the chain structure. 9. Adopts infrared + hot air combined mixed preheating module, drawer type structure. Fast preheating, uniform temperature; fully reduce the temperature difference between large and small components, convenient maintenance.  

PLC control industry product characteristics and the selective soldering process requirements:   PLC is a digital operation electronic system designed for application in industrial environment. It uses a programmable memory, in its internal storage to perform logical operations, sequential control, timing, counting and arithmetic operations and other operation orders, through digital or analog input/output control various types of machinery or production process, its products are widely used in communications, automotive electronics, automation machinery industry and other fields. PLC internal main body is MCU (microprocessor), DSP (digital signal processor) CPLD (logic programming), capacitance, inductance, IO terminals and other components.     PLC control mainboard consists of plug-in and SMT components, the components size difference is big, and the product components welding has high requirements of performance, in order to ensure that the welding performance at the same time to ensure that no damage to other components. Suneast technology selective soldering equipment solution:   For the welding of the components on the PLC control mainboard, the selective soldering machine only sprays the flux for the components that need to be welded, and ensure that the flux spraying on the welding pad is uniform, at the same time, ensure not to affect other components. The preheating module adopts segmented control, and the whole preheating range can be set according to the size of the product, which can not only meet the welding preheating temperature, but also save the power consumption. The welding nozzle is selected according to the distance between the components on the board and the welding requirement, with different sizes and models to ensure the welding quality.   Suneast selective soldering for PLC mainboard welding has the following characteristics:   1. Conveying chain combine with roller structure, smooth transport. 2. Adopts the imported drop nozzle, the flux spraying is more uniform, and the through hole penetration is stronger. 3. Independent infrared + hot air combined mixed preheating module, fast preheating, uniform temperature, and convenient maintenance. 4. Equipped with different size nozzle, suitable for welding different components, to meet the welding quality.

Product characteristics and wave soldering process requirements of power supply industry: Power supply is widely used in communication, automotive electronics, mobile phones and other fields; Emerson is the typical company in the communication power supply industry. The power supply board is mainly used for power processing. The power supply board is generally equipped with electrolytic capacitor, safety capacitor, optocoupler, common mode inductor, common inductor, ceramic capacitor, rectifier bridge and switch. Of course, there are basic components transformer, diode and audion that will be equipped with common electrical appliances. Due to the large number of power supply board plug-ins and the large size difference of components, the welding process has high requirements for the uniformity of wave soldering spray, preheating uniformity and penetration of welding.     Suneast Technology wave soldering equipment： Power boards come in sizes ranging from mobile phone chargers to network base station power boards. For the power supply board, if the spray is not uniform and the penetration is not good, it will directly affect the effect of soldering, resulting in poor welding and damage the power supply board. For large and super-large power board, preheat module is very important, the difference of the components size on large board is big, and the heat absorption capacity is significantly different, if the preheat modules cannot compensate the heating in time and minimize the temperature difference between the size of components which make the small components temperature overheating, and the temperature of big components is not enough. It will directly lead to cold welding, cold joint and other bad welding effect. In the most important welding area, if the nozzle cannot form a variety of shapes of wave, it cannot meet the requirements of different power board welding process, which leads to poor soldering effect, fails of meeting the requirements of welding process, and results in waste.   Suneast technology wave soldering has the following characteristics: 1. Adopts heavy type fingers. The power board is relatively heavy; the heavy type finger structure can prevent deformation and make smooth transportation. 2. The vertical spray patented technology makes spraying more uniform, and stronger through-hole penetration. 3. Infrared + hot air combined preheating module, drawer type structure. Fast warming, uniform temperature; fully reduce the temperature difference between large and small components, convenient equipment maintenance. 4. The soldering nozzle can forms a variety of waveform, which is suitable for soldering different power board, especially to meet the power board solder climbing effect to ensure the soldering quality. 5. For the super large power supply board, the hot air top heating module can be appropriately added according to the actual situation to meet the heat absorption requirements of large components on the top of the board, it’s better to reduce the temperature difference between large and small components, and ensure the welding quality. 6. The forced up and down air cooling is fast, and better for welding quality.