Cases

Product characteristics and wave soldering process requirements of home appliance industry: Household appliances (referred to as home appliances) mainly refer to all kinds of electrical appliances and electronic appliances used in homes and similar places. Also known as civilian appliances, household appliances. Household appliances have become the necessities of modern family life and are closely related to everyone's life.   The classification of household appliances has not been unified in the world. However, it is common to classify according to their functions and application, which can be roughly divided into 8 categories: ① Refrigeration appliances; ② Sir conditioner; ③ Clean electrical appliances; ④ Kitchen appliances; ⑤ Electric heating appliances; ⑥ Beauty and health appliances; ⑦ Audio and video appliances; ⑧ Other electrical appliances, such as fireworks alarm, electric bell, etc.     Suneast wave soldering application solution in appliance products:   The control board of home appliance (main board) and power supply board are similar, it not only provides power, but also plays the role of control program action to home appliance. Because home appliances are required to have a long service life, so the solder joint requirements of the control board are also extremely strict. The solder joint cannot have virtual welding, false welding, air holes and other poor welding. When there are vibration, knock against on the appliances, the solder joints of the control board (motherboard) cannot loose, and even fall off. Once such a situation occurs, after-sales service is a must, and even need completely replacement of the control board. It does not only bring economic lost to consumers, and gives shock to the consumer confidence.     Suneast wave welding characteristics in the control board (motherboard) welding of home appliance industry:   1. The conveyor system adopts heavy type finger. Most of the home appliance control board is produced with fixture and heavy. The heavy type finger structure can prevent deformation, and promise smooth transportation. 2. Vertical spraying patented technology, spray more uniform, through-hole penetration is stronger, good for solder climbing. 3. Infrared + hot air combined mixed preheating module, drawer type structure. Fast preheating, uniform temperature; fully reduce the temperature difference between large and small components, convenient for maintenance. 4. The unique mirror waveform nozzle structure of Suneast technology is suitable for welding all household appliances control board (main board), its wave peak stability is excellent, fully ensure the stability and consistency of welding quality. 5. For welding the SMT components and the plug-in parts on the control board, Suneast technology turbulence wave can fully ensure the welding quality of the shadow part of the SMT components, no leakage welding, no joints welding. 6. Forced natural air up and down fast cooling, good for welding quality.

Semiconductor industry characteristics and reflow oven process requirements:   In order to meet the high density, low void content, and miniaturization design requirements of the electronic products, the packaging welding quality is becoming more and more high, many electronics manufacturers require to semiconductor reflow oven, to make the solder paste printed on the convex metal surface to be reflowed into ball shape, and make the tin ball combined with the base board, and then the chip is joint to the integrated circuit boards, It is also needed to weld the chips and circuit boards together, so it is essential for chip packaging and the manufacturing of integrated circuits.   The represents customers of semiconductor chip welding, such as ASE, Tianshui Huatian, STS, etc.     Semiconductor chip belongs to small size product, the welding pad particles are small, and so it has higher requirements for welding transport system stability, hot air volume control, cooling air volume control, hot air temperature uniformity, nitrogen protection, furnace oxygen content uniformity and so on.   Suneast semiconductor reflow oven solutions:   For semiconductor chip welding, it has high requirement for the empty rate for welds, solder joint shapes, and solder joint surface brightness, so the uniformity for semiconductor reflow soldering temperature control, nitrogen protection, oxygen content control, the stability of the transportation and so on are especially important for the semiconductor reflow oven, otherwise it may cause some solder joints virtual welding, the surface may has a concave points, empty rate may be higher, solder joints offset, Irregular shape and other undesirable phenomena, which cannot meet the requirements of welding process.   Suneast reflow oven has the following characteristics for the semiconductor industry:   1. Mesh belt transmission, stable, reliable, easy to maintain.   2. Multiple sections of independent temperature control, separate frequency converter control for each section, effectively control the volume of hot air in each section of the temperature area, to ensure the uniformity of temperature.   3. The whole process is filled with nitrogen, and nitrogen in each temperature zone can be adjusted independently to ensure that nitrogen in the furnace is uniform and reliable.   4. Three cooling zones, which are controlled by independent inverter, effectively control the cooling slope, and meet the process requirements.   5. Multi-point oxygen concentration detection in the furnace, real-time detection of oxygen content data in each process section of the furnace.   6. New flux recovery system, ensure flux recovery more thoroughly, keep the furnace clean, save maintenance time, reduce the cost of use.

Mini LED industry characteristics and reflow welding process requirements:   With the rapid development of Mini LED display technology, Mini LED display products have been applied to super large screen HD display, such as monitor and command, HD studio, high-end cinema, medical diagnosis, advertising display, conference and exhibition, office display, virtual reality and other commercial fields. Mini LED is a backlight technology. Compared with traditional LED, it has smaller particles, finer display effect and higher brightness. At the same time, it is more energy-efficient than traditional LED, and supports accurate dimming, which will not cause the problem of uneven backlight of LED. The product pad size between 50 to 200 μm.   Mini LED has higher requirements for hot air flow control, cooling air flow control, hot air temperature uniformity, nitrogen protection, uniformity of oxygen content in the furnace and so on, due to the small particle size of the pad.     Mini LED reflow oven solution:   Mini LED pads have large and small sizes. There are usually thousands of chips and tens of thousands of solder joints on each Mini LED circuit board to connect RGB tri-color chips. The big welding spots on the product bring very great difficulty to the chip packaging welding, for big size products with number of welding spots, the reflow soldering temperature uniformity control, nitrogen and oxygen content control, and other aspects are especially important, otherwise it may cause some welding point virtual welding, surface black, welding spots offset phenomenon, which cannot meet the welding process requirements.   Suneast technology reflow oven has the following characteristics for Mini LED industry:   1. Segmented independent temperature control, with separate inverter control, effectively control the volume of hot air in each section of the temperature area, to ensure the uniformity of temperature.   2. The whole process is filled with nitrogen, and the nitrogen in each temperature zone is adjusted independently to ensure that nitrogen in the furnace is uniform and reliable.   3. Upper and lower double cooling zone, with independent inverter control, effectively control the cooling slope.   4. Many oxygen concentration detection points in the furnace, real-time detection of oxygen content data in each process section of the oven.   5. New flux recovery system, ensure flux recovery more thoroughly, keep the furnace clean, save maintenance time, reduce the cost of use.  

FPC flexible circuit board product characteristics and reflow welding process requirements: FPC flexible circuit board, also known as flexible board, is a conductor circuit pattern on a flexible substrate surface by using optical imaging image transfer and corrosion process methods. The surface layer and the inner layer of the double-sided and multi-layer circuit board realize the internal and external electrical connection, through the metallization connection; the line graphic surface is protected and insulated by PI and glue. It is mainly divided into single side board, hollow board, double side board, multi board, soft and hard combination board. Its characteristics are: small size, light weight, flexible, bending, thin, which are widely used in precision small electronic equipment, and can be used to connect dynamic electronic parts.     Due to the characteristics of small size, light weight and thin thickness, FPC products have high requirements for hot air flow control, cooling air flow control, hot air temperature uniformity, nitrogen local protection, etc.   It is mainly used in mobile phones, laptops, scanning guns, digital cameras, tablet computers, LCD monitors and other products.   Reflow welding solution According to the characteristics of FPC products such as small size, light weight and thin thickness, it is particularly important to ensure the uniformity of temperature control; nitrogen protection and air flow control for reflow welding. Otherwise, it may cause some bad phenomena such as false welding and welding spot offset, which cannot meet the requirements of welding process.   Suneast reflow oven has the following characteristics for FPC industry: 1. The heating and cooling zones are controlled independently by separate inverter, which can effectively control the air volume of each section, to ensure the uniformity of temperature, and meets the cooling slope requirement. 2. With nitrogen protection, prevent pad oxidation which will result in bad welding. 3. Double cooling zones, effectively control the cooling slope. 4. New flux recovery system, ensure flux recovery more thoroughly, keep the furnace clean, save maintenance time, reduce the cost of use.  

Characteristics of military aerospace products and the reflow welding process requirements:   Due to its special requirements and application, the welding process and conventional welding process of military PCB is very different than others, require the solder joint to be more reliable, and more durable, BGA components welding quality to be more solid, and for multi-layer PCB products welding.     Because of the particularity of military products, there are high requirements for hot air volume control, cooling air volume control, hot air temperature uniformity, nitrogen protection, uniformity of oxygen content in the furnace and so on, during the welding.   Reflow welding equipment solution: Military industry products have below characteristics, big size, multilayer, the size of the component differentiation is bigger, high heat absorption, so it is important to control the reflow soldering temperature uniformity, nitrogen protection, oxygen content, etc; otherwise it may cause some solder joints virtual welding, black surface, as well as the welding is not firm, which will not meet the welding process requirements.   Suneast Technology reflow oven has the following advantages for the welding of military and aerospace industry:   1. Independent temperature control for sections, separate frequency converter control, which will effectively control the hot air volume in each section of the temperature zone, to ensure the temperature uniformity.   2. The whole process is filled with nitrogen, and nitrogen is independently adjusted in each temperature zone to ensure uniform and reliable nitrogen in the furnace.   3, Multiple cooling zones, with independent frequency converter control, which will effective control the cooling slope.   4. New flux recovery system ensures flux recovery more thoroughly, keeps the furnace clean, saves maintenance time and reduces use cost.   5. The key control components are imported brands.