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Home > Products >
IC Bonding Machine
>
Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
All Category

Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment
Contact Us
Ms. Yang
yanglin@suneast.com.cn
+86 13714780575
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  • name
  • name

Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment

Brand Name: Suneast
Model Number: WBD2200
MOQ: ≥1 pc
Price: Negotiable
Packaging Details: Plywood crate
Payment Terms: T/T
Detail Information
Product Description
Detail Information
Place of Origin:
Shenzhen, Guangdong Province, China
Certification:
CE、ISO
Name:
IC Bonder
Model:
WBD2200
Machine Dimension:
1255(L)*1625(W)*1610(H)mm
Placement Accuracy:
±15um@3σ
Die Size:
0.25*0.25mm-10*10mm
Substrate Size:
150(L)*50(W)~300(L)*100(W)mm
Substrate Thickness:
0.1~2mm
Placement Pressure:
30～7500g
Glue Feeding Mode:
Dispensing，dipping Glue，painting Glue
Customizable:
Yes
Highlight:

soldering combined multi module wave selective

,

selective multi module combined wave soldering

,

combined wave soldering selective multi module

Product Description
Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
Product Overview
The WBD2200 IC Bonder is a high-precision multilayer bonding machine designed for multi-chip placement. Featuring advanced vision systems and thermal compensation algorithms, it delivers exceptional accuracy and speed for industrial semiconductor applications.
Key Specifications
Attribute Specification
Model WBD2200
Machine Dimensions 1255(L)×1625(W)×1610(H)mm
Placement Accuracy ±15um@3σ
Die Size Range 0.25×0.25mm to 10×10mm
Substrate Size 150(L)×50(W) to 300(L)×100(W)mm
Substrate Thickness 0.1-2mm
Placement Pressure 30-7500g
Glue Feeding Modes Dispensing, Dipping Glue, Painting Glue
Customization Available
Advanced Features
  • Multilayer Capability: Supports complex multi-chip configurations
  • System-in-Package Technology: Ideal for advanced SIP applications
  • Ultrathin Die Bonding: Precision handling of delicate components
  • Supermini Chip Bonding: Capable of handling chips as small as 0.25×0.25mm
  • Quick Changeover: Minimizes downtime between production runs
Industrial Applications
The WBD2200 is suitable for IC, WLCSP, TSV, SIP, QFN, LGA, and BGA processes. Ideal for manufacturing optical communication modules, camera modules, LED components, power modules, vehicle electronics, 5G RF components, memory devices, MEMS, and various sensors.
Technical Parameters
Parameter Specification
Placement Accuracy ±15um@3σ
Wafer Size 4"/6"/8" (Optional: 12")
Placement Head 0-360° rotation with auto-change nozzle (optional)
Core Motion Module Linear motor + grating scale
Machine Base Marble platform for stability
Loading/Unloading Manual or automatic options
Installation Requirements
1. Leakage protection switch: ≥100ma
2. Compressed air: 0.4-0.6Mpa (Inlet pipe: Ø10mm)
3. Vacuum requirement: <-88kPa (Inlet pipe: Ø10mm, 2 tracheal joints)
4. Power: AC220V, 50/60Hz (Three core power copper wire ≥2.5mm², 50A leakage protection switch ≥100mA)
5. Floor loading capacity: ≥800kg/m²
Tags: 

die bonding machine  

automatic die bonder  

chip bonding machine

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Products Details

Home > Products >
IC Bonding Machine
>
Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
All Category

Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment
name
  • name
  • name
  • name

Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment

Brand Name: Suneast
Model Number: WBD2200
MOQ: ≥1 pc
Price: Negotiable
Packaging Details: Plywood crate
Payment Terms: T/T
Detail Information
Product Description
Detail Information
Place of Origin:
Shenzhen, Guangdong Province, China
Brand Name:
Suneast
Certification:
CE、ISO
Model Number:
WBD2200
Name:
IC Bonder
Model:
WBD2200
Machine Dimension:
1255(L)*1625(W)*1610(H)mm
Placement Accuracy:
±15um@3σ
Die Size:
0.25*0.25mm-10*10mm
Substrate Size:
150(L)*50(W)~300(L)*100(W)mm
Substrate Thickness:
0.1~2mm
Placement Pressure:
30～7500g
Glue Feeding Mode:
Dispensing，dipping Glue，painting Glue
Customizable:
Yes
Minimum Order Quantity:
≥1 pc
Price:
Negotiable
Packaging Details:
Plywood crate
Delivery Time:
25~50 days
Payment Terms:
T/T
Highlight:

soldering combined multi module wave selective

,

selective multi module combined wave soldering

,

combined wave soldering selective multi module

Product Description
Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
Product Overview
The WBD2200 IC Bonder is a high-precision multilayer bonding machine designed for multi-chip placement. Featuring advanced vision systems and thermal compensation algorithms, it delivers exceptional accuracy and speed for industrial semiconductor applications.
Key Specifications
Attribute Specification
Model WBD2200
Machine Dimensions 1255(L)×1625(W)×1610(H)mm
Placement Accuracy ±15um@3σ
Die Size Range 0.25×0.25mm to 10×10mm
Substrate Size 150(L)×50(W) to 300(L)×100(W)mm
Substrate Thickness 0.1-2mm
Placement Pressure 30-7500g
Glue Feeding Modes Dispensing, Dipping Glue, Painting Glue
Customization Available
Advanced Features
  • Multilayer Capability: Supports complex multi-chip configurations
  • System-in-Package Technology: Ideal for advanced SIP applications
  • Ultrathin Die Bonding: Precision handling of delicate components
  • Supermini Chip Bonding: Capable of handling chips as small as 0.25×0.25mm
  • Quick Changeover: Minimizes downtime between production runs
Industrial Applications
The WBD2200 is suitable for IC, WLCSP, TSV, SIP, QFN, LGA, and BGA processes. Ideal for manufacturing optical communication modules, camera modules, LED components, power modules, vehicle electronics, 5G RF components, memory devices, MEMS, and various sensors.
Technical Parameters
Parameter Specification
Placement Accuracy ±15um@3σ
Wafer Size 4"/6"/8" (Optional: 12")
Placement Head 0-360° rotation with auto-change nozzle (optional)
Core Motion Module Linear motor + grating scale
Machine Base Marble platform for stability
Loading/Unloading Manual or automatic options
Installation Requirements
1. Leakage protection switch: ≥100ma
2. Compressed air: 0.4-0.6Mpa (Inlet pipe: Ø10mm)
3. Vacuum requirement: <-88kPa (Inlet pipe: Ø10mm, 2 tracheal joints)
4. Power: AC220V, 50/60Hz (Three core power copper wire ≥2.5mm², 50A leakage protection switch ≥100mA)
5. Floor loading capacity: ≥800kg/m²
Tags: 

die bonding machine

automatic die bonder

chip bonding machine

Related Products
Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment Video

Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment

Get Best Price
High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders Video

High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

Get Best Price
Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine Video

Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine

Get Best Price
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine Video

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Get Best Price
Sintering Die Bonder SDB 200 Video

Sintering Die Bonder SDB 200

Get Best Price
IC Bonding Machine Video

IC Bonding Machine

Get Best Price
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