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Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment

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Ms. Yang

yanglin@suneast.com.cn

+86 13714780575

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Multilayer IC Bonding Machine 0.250.25mm-1010mm Die Bonder Equipment

Brand Name:	Suneast
Model Number:	WBD2200
MOQ:	≥1 pc
Price:	Negotiable
Packaging Details:	Plywood crate
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen, Guangdong Province, China

Certification:

CE、ISO

Name:

IC Bonder

Model:

WBD2200

Machine Dimension:

1255(L)*1625(W)*1610(H)mm

Placement Accuracy:

±15um@3σ

Die Size:

0.25*0.25mm-10*10mm

Substrate Size:

150(L)*50(W)~300(L)*100(W)mm

Substrate Thickness:

0.1~2mm

Placement Pressure:

30～7500g

Glue Feeding Mode:

Dispensing，dipping Glue，painting Glue

Customizable:

Highlight:

soldering combined multi module wave selective

selective multi module combined wave soldering

combined wave soldering selective multi module

Product Description

Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment

Product Overview

The WBD2200 IC Bonder is a high-precision multilayer bonding machine designed for multi-chip placement. Featuring advanced vision systems and thermal compensation algorithms, it delivers exceptional accuracy and speed for industrial semiconductor applications.

Key Specifications

Attribute	Specification
Model	WBD2200
Machine Dimensions	1255(L)×1625(W)×1610(H)mm
Placement Accuracy	±15um@3σ
Die Size Range	0.25×0.25mm to 10×10mm
Substrate Size	150(L)×50(W) to 300(L)×100(W)mm
Substrate Thickness	0.1-2mm
Placement Pressure	30-7500g
Glue Feeding Modes	Dispensing, Dipping Glue, Painting Glue
Customization	Available

Advanced Features

Multilayer Capability: Supports complex multi-chip configurations
System-in-Package Technology: Ideal for advanced SIP applications
Ultrathin Die Bonding: Precision handling of delicate components
Supermini Chip Bonding: Capable of handling chips as small as 0.25×0.25mm
Quick Changeover: Minimizes downtime between production runs

Industrial Applications

The WBD2200 is suitable for IC, WLCSP, TSV, SIP, QFN, LGA, and BGA processes. Ideal for manufacturing optical communication modules, camera modules, LED components, power modules, vehicle electronics, 5G RF components, memory devices, MEMS, and various sensors.

Technical Parameters

Parameter	Specification
Placement Accuracy	±15um@3σ
Wafer Size	4"/6"/8" (Optional: 12")
Placement Head	0-360° rotation with auto-change nozzle (optional)
Core Motion Module	Linear motor + grating scale
Machine Base	Marble platform for stability
Loading/Unloading	Manual or automatic options

Installation Requirements

1. Leakage protection switch: ≥100ma

2. Compressed air: 0.4-0.6Mpa (Inlet pipe: Ø10mm)

3. Vacuum requirement: <-88kPa (Inlet pipe: Ø10mm, 2 tracheal joints)

4. Power: AC220V, 50/60Hz (Three core power copper wire ≥2.5mm², 50A leakage protection switch ≥100mA)

5. Floor loading capacity: ≥800kg/m²

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SMT Peripheral Equipment

products details

Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment

Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment

soldering combined multi module wave selective

selective multi module combined wave soldering

combined wave soldering selective multi module

Multilayer IC Bonding Machine 0.250.25mm-1010mm Die Bonder Equipment