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IC Bonding Machine

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Ms. Yang

yanglin@suneast.com.cn

+86 13714780575

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IC Bonding Machine

Brand Name:	Suneast
Model Number:	WBD2200 \| WBD2200 Plus \| CBD2200 \| CBD2200 EVO \| SDB 200
MOQ:	≥1 pc
Price:	Negotiable
Packaging Details:	Plywood crate
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen, Guangdong Province, China

Certification:

CE、ISO

Highlight:

combined selective multi module wave solder

wave soldering multi module combined selective

combined multi module wave solder selective

Product Description

IC Bonding Machine

The IC bonder is designed for multi-chip placement applications, featuring a mature technology platform that delivers superior accuracy through an advanced vision system and thermal compensation algorithm. The machine achieves higher operational speeds via an innovative image processing unit and optimized architecture.

Applications

This IC bonding machine is suitable for processing various package types including:

IC, WLCSP, TSV, SIP
QFN, LGA, BGA

Ideal for manufacturing components such as:

Optical communication modules
Camera modules and LED products
Power modules and power devices
Vehicle electronics and 5G RF components
Memory, MEMS, and various sensors

Machine Gallery

Precision die bonding | Semiconductor manufacturing | Chip placement technology | Automated IC assembly

Tags:

Products Details

Home > Products >

IC Bonding Machine

All Category

IC Bonding Machine

Brand Name:	Suneast
Model Number:	WBD2200 \| WBD2200 Plus \| CBD2200 \| CBD2200 EVO \| SDB 200
MOQ:	≥1 pc
Price:	Negotiable
Packaging Details:	Plywood crate
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen, Guangdong Province, China

Brand Name:

Suneast

Certification:

CE、ISO

Model Number:

WBD2200 | WBD2200 Plus | CBD2200 | CBD2200 EVO | SDB 200

Minimum Order Quantity:

≥1 pc

Price:

Negotiable

Packaging Details:

Plywood crate

Delivery Time:

25~50 days

Payment Terms:

T/T

Highlight:

combined selective multi module wave solder

wave soldering multi module combined selective

combined multi module wave solder selective

Product Description

IC Bonding Machine

Applications

This IC bonding machine is suitable for processing various package types including:

IC, WLCSP, TSV, SIP
QFN, LGA, BGA

Ideal for manufacturing components such as:

Optical communication modules
Camera modules and LED products
Power modules and power devices
Vehicle electronics and 5G RF components
Memory, MEMS, and various sensors

Machine Gallery

Precision die bonding | Semiconductor manufacturing | Chip placement technology | Automated IC assembly

Tags:

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