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IC Bonding Machine
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IC Bonding Machine

IC Bonding Machine

Brand Name: Suneast
Model Number: WBD2200 | WBD2200 Plus | CBD2200 | CBD2200 EVO | SDB 200
MOQ: ≥1 pc
Price: Negotiable
Packaging Details: Plywood crate
Payment Terms: T/T
Detail Information
Place of Origin:
Shenzhen, Guangdong Province, China
Certification:
CE、ISO
Highlight:

combined selective multi module wave solder

,

wave soldering multi module combined selective

,

combined multi module wave solder selective

Product Description

    IC Bonding Machine

 

The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture.

    IC bonder is suit able for IC,WLCSP,TSV, SIP,QFN,LGA,BGA process products. Such as optical communication module, camera module, LED, power module, power device, vehicle electronics, 5G RF, memory, MEMS, various sensors, etc.

 

IC Bonder Machine

IC Bonding Machine 0 IC Bonding Machine 1 IC Bonding Machine 2

IC Bonding Machine 3 

 

Good price  online

Products Details

Home > Products >
IC Bonding Machine
>
IC Bonding Machine

IC Bonding Machine

Brand Name: Suneast
Model Number: WBD2200 | WBD2200 Plus | CBD2200 | CBD2200 EVO | SDB 200
MOQ: ≥1 pc
Price: Negotiable
Packaging Details: Plywood crate
Payment Terms: T/T
Detail Information
Place of Origin:
Shenzhen, Guangdong Province, China
Brand Name:
Suneast
Certification:
CE、ISO
Model Number:
WBD2200 | WBD2200 Plus | CBD2200 | CBD2200 EVO | SDB 200
Minimum Order Quantity:
≥1 pc
Price:
Negotiable
Packaging Details:
Plywood crate
Delivery Time:
25~50 days
Payment Terms:
T/T
Highlight:

combined selective multi module wave solder

,

wave soldering multi module combined selective

,

combined multi module wave solder selective

Product Description

    IC Bonding Machine

 

The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture.

    IC bonder is suit able for IC,WLCSP,TSV, SIP,QFN,LGA,BGA process products. Such as optical communication module, camera module, LED, power module, power device, vehicle electronics, 5G RF, memory, MEMS, various sensors, etc.

 

IC Bonder Machine

IC Bonding Machine 0 IC Bonding Machine 1 IC Bonding Machine 2

IC Bonding Machine 3