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High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

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+86 13714780575

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High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

Brand Name:	Suneast
Model Number:	WBD2200 PLUS
MOQ:	≥1 pc
Price:	Negotiable
Packaging Details:	Plywood crate
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen, Guangdong Province, China

Certification:

CE、ISO

Name:

IC Bonder

Model:

WBD2200 PLUS

Machine Dimension:

2480(L)*1470(W)*1700(H)mm

Placement Accuracy:

≤±15um@3σ

Placement Angle Accuracy:

±0.3 °@3σ

Die Size:

0.25*0.25mm-10*10mm

Core Module Movement Mode:

Linear Motor + Grating Scale

Glue Feeding Mode:

Dispensing + Painting Glue

Loading / Unloading:

Manual / Auto

Customizable:

Highlight:

combined wave soldering multi module selective

magnetic spring motor ce iso

iso ce magnetic spring motor

Product Description

High Precision IC Bonding Machine WBD2200 PLUS

8-12 Inch Wafers Die Bonders

Product Overview

The WBD2200 PLUS is a general type high-precision IC bonder designed for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other advanced processes.

Key Features

Multilayer capability for complex assemblies
Automatic nozzle change system
Supermini chip placement technology
Compatible with 8-12 inch wafers
Ultrathin die bonding technology
Bottom photo-taking for high precision placement
Automatic loading and unloading systems
Automatic wafer change capability

Technical Specifications

Attribute	Specification
Model	WBD2200 PLUS
Machine Dimensions	2480(L) × 1470(W) × 1700(H) mm
Placement Accuracy	≤±15μm @3σ
Placement Angle Accuracy	±0.3° @3σ
Die Size Range	0.25 × 0.25mm - 10 × 10mm
Core Module Movement	Linear motor + grating scale
Glue Feeding Mode	Dispensing + painting glue
Loading/Unloading	Manual / auto options
Customization	Available

Advanced Capabilities

High Precision Placement

Accuracy: ±15μm @3σ
Angle accuracy: ±0.3° @3σ

Material Box Loading

Fully automatic feeding system with SMEMA/SECS/GEM protocol support

Stacking Loading

Multiple feeding methods with stacking compatibility

Nozzle Station

Fully automatic wafer loading/unloading with SECS/GEM protocol

Visual Recognition

2448×2048 resolution with 256 gray levels and ±0.01deg accuracy

Real-time Compensation

Automatic post-bonding detection and compensation for stable accuracy

Detailed Parameters

Parameter	Specification
Force Control Range	20-1000g (configurable up to 7500g)
Force Control Accuracy	20g-150g: ±2g @3σ 150g-1000g: ±5% @3σ
Silicon Wafer Processing	Max 12" (300mm), compatible with 8" (150mm)
Applicable Material Box	L 110-310; W 20-110; H 70-153 mm
Applicable Lead Frame	L 100-300; W 38-100; H 0.1-0.8 mm
Bottom Photo-taking	Optional
Weight	Approx. 1800Kg

Installation Requirements

Electrical Requirements: AC220V, 50/60Hz; ≥2.5mm² copper wire; 50A leakage protection switch (≥100mA)

Air Supply: 0.4-0.6Mpa compressed air; Ø10mm inlet pipe

Vacuum: <-88kPa; Ø10mm inlet pipe (2 tracheal joints)

Floor Loading: Minimum 800kg/m² capacity

Applications

Ideal for automotive electronics, medical electronics, optoelectronics, mobile devices, and other industries requiring high precision IC bonding for wafer loading products, SIP packaging, Memory Stack Die, CMOS, and MEMS processes.

Tags:

die bonding machine

automatic die bonder

chip bonding machine

Multilayer IC Bonding Machine 0.250.25mm-1010mm Die Bonder Equipment

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