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High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

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High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

Brand Name:	Suneast
Model Number:	WBD2200 PLUS
MOQ:	≥1 pc
Price:	Negotiable
Packaging Details:	Plywood crate
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen, Guangdong Province, China

Certification:

CE、ISO

Name:

IC Bonder

Model:

WBD2200 PLUS

Machine Dimension:

2480(L)*1470(W)*1700(H)mm

Placement Accuracy:

≤±15um@3σ

Placement Angle Accuracy:

±0.3 °@3σ

Die Size:

0.25*0.25mm-10*10mm

Core Module Movement Mode:

Linear Motor + Grating Scale

Glue Feeding Mode:

Dispensing + Painting Glue

Loading / Unloading:

Manual / Auto

Customizable:

Highlight:

combined wave soldering multi module selective

magnetic spring motor ce iso

iso ce magnetic spring motor

Product Description

High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

Product Specifications

Attribute	Value
Name	IC Bonder
Model	WBD2200 PLUS
Machine dimension	2480(L)1470(W)1700(H)mm
Placement accuracy	≤±15um@3σ
Placement angle accuracy	±0.3 °@3σ
Die size	0.250.25mm-1010mm
Core module movement mode	Linear motor + grating scale
Glue feeding mode	Dispensing + painting glue
Loading / Unloading	Manual / auto
Customizable	Yes

Product Description

Automatic Nozzle Change High Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers

General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes.

Features

Multilayer capability
Automatic nozzle change
Supermini chip placement
Compatible with 8-12 inch wafers
Ultrathin die bonding technology
Bottom photo-taking, high precision placement
Automatic loading and unloading
Automatic wafer change

Main Application

It is suitable for mass wafer loading products, and for SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. It is mainly used in automotive electronics, medical electronics, optoelectronics, mobile phones and other industries.

Product Advantages

High precision
Accuracy: ±15μm@3σ
Angle: Die size: > 1 x 1 mm ±0.3°@3σ
Die size: < 1 x 1 mm ±1°@3σ

Material box loading
Fully automatic feeding and discharging Warehouse processing system, supported by SMEMA online communication agreement, support the SECS/GEM protocol

Stacking loading
Multiple feeding methods, compatible with stacking feeding function, improving customer selectivity

Nozzle station
Equipped with a fully automatic wafer loading and unloading processing system, support to the SECS/GEM protocol

Visual recognition
2448x2048 resolution 256 gray levels Support gray value template, custom shape template The platform can be positioned twice The angle error is ±0.01deg

Real-time compensation
It can detect the image after bonding and do automatic real-time compensation to ensure stable mounting accuracy

Technical Parameters

Item	Specification
Placement accuracy	±15um@3σ
Placement angle accuracy	±0.3°@3σ
Force control range	20~1000g(with different configurations, the maximum support is 7500g)
Force control accuracy	20g-150g:± 2g@3σ 150g-1000g:±5%@3σ
Silicon wafer processing(mm)	Maximum 12"(300mm) Compatible 8"(150mm)
Die size(mm)	0.250.25mm-1010mm
Loading / Unloading	Manual / auto
Applicable material box(mm)	L 110-310; W 20-110; H 70-153
Applicable lead frame(mm)	L 100-300; W38-100; H 0.1-0.8
Core module movement mode	Linear motor + grating scale
Glue feeding mode	Dispensing + painting glue
Bottom photo-taking	Option
Machine dimension(mm)	L(2480)W(1470)H(1700)
Weight	Net weight of equipment: Approx.1800Kg

Installation Requirements

1. Leakage protection switch: ≥100ma

2. Compressed air requirement: 0.4-0.6Mpa
Inlet pipe specification: Ø10mm

3. Vacuum requirement: <-88kPa
Inlet pipe specification: Ø10mm
Tracheal joint: 2 pieces

4. Power requirements:
①Voltage: AC220V, frequency 50/60HZ;
②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA.

5. The ground is required to withstand a pressure of 800kg/m²

Tags:

die bonding machine

automatic die bonder

chip bonding machine

Multilayer IC Bonding Machine 0.250.25mm-1010mm Die Bonder Equipment

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