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High Precision IC Bonder 8-12 Inch Wafers

IC Bonding Machine
December 29, 2025
Category Connection: IC Bonding Machine
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Tags:
#die bonding machine #automatic die bonder #chip bonding machine
Brief: Observe the step-by-step operation and see practical examples of usage in this video showcasing the High Precision IC Bonding Machine WBD2200 PLUS. You will see a detailed demonstration of its automatic nozzle change, high-precision placement for 8-12 inch wafers, and its application in SIP packaging, Memory Stack Die, and MEMS processes. Learn how its visual recognition and real-time compensation systems ensure stable mounting accuracy for automotive and medical electronics.
Related Product Features:
  • Achieves high placement accuracy of ≤±15um and angle accuracy of ±0.3° for die sizes over 1x1mm.
  • Features automatic nozzle change and supports both dispensing and painting glue feeding modes.
  • Capable of handling supermini chips from 0.25x0.25mm up to 10x10mm.
  • Compatible with 8-inch to 12-inch wafers and includes ultrathin die bonding technology.
  • Equipped with bottom photo-taking and visual recognition for high precision placement.
  • Offers automatic loading and unloading with material box and stacking loading options.
  • Includes real-time compensation to detect images after bonding and maintain stable accuracy.
  • Supports multilayer capability and is customizable for various industrial applications.
FAQs:
  • What is the placement accuracy of the WBD2200 PLUS IC Bonder?
    The WBD2200 PLUS offers a high placement accuracy of ≤±15um at 3σ, ensuring precise die bonding for demanding applications.
  • What wafer sizes is this bonding machine compatible with?
    This machine is compatible with 8-inch (150mm) to 12-inch (300mm) wafers, making it versatile for various semiconductor manufacturing needs.
  • Does the machine support automatic loading and unloading?
    Yes, the WBD2200 PLUS supports both manual and automatic loading/unloading, including material box and stacking loading systems for efficient production.
  • What industries is this IC bonder primarily used in?
    It is mainly used in automotive electronics, medical electronics, optoelectronics, mobile phones, and other industries requiring high-precision die bonding.
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