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IC Bonding Machine
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High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Brand Name: Suneast
Model Number: CBD2200 EVO
MOQ: ≥1 pc
Price: Negotiable
Packaging Details: Plywood crate
Payment Terms: T/T,
Detail Information
Place of Origin:
Shenzhen, Guangdong Province, China
Certification:
CE、ISO
Name:
IC Bonder
Model:
CBD2200 EVO
Machine Dimension:
1400(L)*1250(W)*1700(H)mm
Weight:
Approx.1500Kg
Placement Accuracy:
≤±10um@3σ
Placement Angle Accuracy:
±0.15°@3σ
Substrate Pallet Size:
L200 X W90~150mm
Core Module Movement Mode:
Linear Motor + Grating Scale
Glue Feeding Mode:
Dispensing + Painting Glue
Customizable:
Yes
Highlight:

spring motor ce iso magnetic

,

motor iso magnetic spring ce

,

selective wave solder multi module combined

Product Description

Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design

 

Features:

  • High speed, accurate solidification capacity ±10um@3σ;
  • High production efficiency, low cost input
  • High multi-chip processing capacity, support 16 different types of chip placement
  • High flexibility to support multiple carrier operations
  • Can work in different plane heights, support deep cavity work
  • Modular platform design, small appearance, small footprint

 

Product advantage:

High precision

Accuracy: ±10μm@3σ

Angle: ±0.15°@3σ

High precision linear motor

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 0

Waffle pack / Gel-Pak

Supports 16 Waffle packs (2 "x 2")

4”x 4”size is available.

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 1

Automatic height measurement

Accuracy: 3μm

Supports a variety of probes

Can be replaced with laser

altimeter according to demand

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 2

Nozzle station

Quick automatic nozzle change

Supports 7 nozzle stations.

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 3

Visual recognition

2448x2048 resolution

256 gray level

Support gray value template,

custom shape template

The platform can be positioned twice.

The Angle error is ±0.01deg.

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 4

Deep cavity operation

Work at different plat heights.

The maximum depth is 11mm.

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 5

 

 

Features of dispensing function:

  • Supports various types of epoxy adhesives
  • Meet various graphic dispensing needs
  • Comes with commonly used standard graphics library
  • Support custom graphics library

 

Product parameters:

Item Specification
Placement accuracy ≤±10um@3σ
Placement angle accuracy ±0.15°@3σ
Force control range 20~1000g(with different configurations, the maximum support is 7500g)
Force control accuracy 20g-150g:± 2g@3σ 150g-1000g:±5%@3σ
Substrate pallet size(mm) L200 X W90~150
Tray size(mm) Based on customer products
Loading/Unloading Manual / auto
IC dimension(mm) L0.25X W0.25—L10 X W10
IC supply Waffle tray
Core module movement mode Linear motor + grating scale
Glue feeding mode Dispensing + painting glue
Auto change nozzle Seven
Bottom photo-taking Equipped with camera
Machine dimension(mm) L(1400)*W(1250)*H(1700)
Weight Net weight of equipment:Approx.1500Kg

 

Notices:

1.Leakage protection switch: ≥100ma

2.Compressed air requirement: 0.4-0.6Mpa

Inlet pipe specification: Ø10mm

3.Vacuum requirement:<-88kPa

Inlet pipe specification: Ø10mm

Tracheal joint: 2 pieces

4.Power requirements:

①Voltage: AC220V, frequency 50/60HZ

②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA

5.The ground is required to withstand a pressure of 800kg/m².

Good price  online

Products Details

Home > Products >
IC Bonding Machine
>
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Brand Name: Suneast
Model Number: CBD2200 EVO
MOQ: ≥1 pc
Price: Negotiable
Packaging Details: Plywood crate
Payment Terms: T/T,
Detail Information
Place of Origin:
Shenzhen, Guangdong Province, China
Brand Name:
Suneast
Certification:
CE、ISO
Model Number:
CBD2200 EVO
Name:
IC Bonder
Model:
CBD2200 EVO
Machine Dimension:
1400(L)*1250(W)*1700(H)mm
Weight:
Approx.1500Kg
Placement Accuracy:
≤±10um@3σ
Placement Angle Accuracy:
±0.15°@3σ
Substrate Pallet Size:
L200 X W90~150mm
Core Module Movement Mode:
Linear Motor + Grating Scale
Glue Feeding Mode:
Dispensing + Painting Glue
Customizable:
Yes
Minimum Order Quantity:
≥1 pc
Price:
Negotiable
Packaging Details:
Plywood crate
Delivery Time:
25~50 days
Payment Terms:
T/T,
Highlight:

spring motor ce iso magnetic

,

motor iso magnetic spring ce

,

selective wave solder multi module combined

Product Description

Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design

 

Features:

  • High speed, accurate solidification capacity ±10um@3σ;
  • High production efficiency, low cost input
  • High multi-chip processing capacity, support 16 different types of chip placement
  • High flexibility to support multiple carrier operations
  • Can work in different plane heights, support deep cavity work
  • Modular platform design, small appearance, small footprint

 

Product advantage:

High precision

Accuracy: ±10μm@3σ

Angle: ±0.15°@3σ

High precision linear motor

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 0

Waffle pack / Gel-Pak

Supports 16 Waffle packs (2 "x 2")

4”x 4”size is available.

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 1

Automatic height measurement

Accuracy: 3μm

Supports a variety of probes

Can be replaced with laser

altimeter according to demand

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 2

Nozzle station

Quick automatic nozzle change

Supports 7 nozzle stations.

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 3

Visual recognition

2448x2048 resolution

256 gray level

Support gray value template,

custom shape template

The platform can be positioned twice.

The Angle error is ±0.01deg.

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 4

Deep cavity operation

Work at different plat heights.

The maximum depth is 11mm.

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 5

 

 

Features of dispensing function:

  • Supports various types of epoxy adhesives
  • Meet various graphic dispensing needs
  • Comes with commonly used standard graphics library
  • Support custom graphics library

 

Product parameters:

Item Specification
Placement accuracy ≤±10um@3σ
Placement angle accuracy ±0.15°@3σ
Force control range 20~1000g(with different configurations, the maximum support is 7500g)
Force control accuracy 20g-150g:± 2g@3σ 150g-1000g:±5%@3σ
Substrate pallet size(mm) L200 X W90~150
Tray size(mm) Based on customer products
Loading/Unloading Manual / auto
IC dimension(mm) L0.25X W0.25—L10 X W10
IC supply Waffle tray
Core module movement mode Linear motor + grating scale
Glue feeding mode Dispensing + painting glue
Auto change nozzle Seven
Bottom photo-taking Equipped with camera
Machine dimension(mm) L(1400)*W(1250)*H(1700)
Weight Net weight of equipment:Approx.1500Kg

 

Notices:

1.Leakage protection switch: ≥100ma

2.Compressed air requirement: 0.4-0.6Mpa

Inlet pipe specification: Ø10mm

3.Vacuum requirement:<-88kPa

Inlet pipe specification: Ø10mm

Tracheal joint: 2 pieces

4.Power requirements:

①Voltage: AC220V, frequency 50/60HZ

②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA

5.The ground is required to withstand a pressure of 800kg/m².