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Home > Products >
IC Bonding Machine
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High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine
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Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment
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yanglin@suneast.com.cn
+86 13714780575
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High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Brand Name: Suneast
Model Number: CBD2200 EVO
MOQ: ≥1 pc
Price: Negotiable
Packaging Details: Plywood crate
Payment Terms: T/T,
Detail Information
Product Description
Detail Information
Place of Origin:
Shenzhen, Guangdong Province, China
Certification:
CE、ISO
Name:
IC Bonder
Model:
CBD2200 EVO
Machine Dimension:
1400(L)*1250(W)*1700(H)mm
Weight:
Approx.1500Kg
Placement Accuracy:
≤±10um@3σ
Placement Angle Accuracy:
±0.15°@3σ
Substrate Pallet Size:
L200 X W90~150mm
Core Module Movement Mode:
Linear Motor + Grating Scale
Glue Feeding Mode:
Dispensing + Painting Glue
Customizable:
Yes
Highlight:

spring motor ce iso magnetic

,

motor iso magnetic spring ce

,

selective wave solder multi module combined

Product Description
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine
Product Overview

The CBD2200 EVO IC Bonder is a high-speed, precision modular platform designed for efficient semiconductor packaging with minimal floor space requirements.

Key Specifications
Attribute Value
Model CBD2200 EVO
Machine Dimensions 1400(L) × 1250(W) × 1700(H) mm
Weight Approx. 1500Kg
Placement Accuracy ≤±10um@3σ
Placement Angle Accuracy ±0.15°@3σ
Substrate Pallet Size L200 × W90~150mm
Movement Mode Linear motor + grating scale
Glue Feeding Mode Dispensing + painting glue
Customization Available
Product Features
  • High-speed operation with ±10um@3σ placement accuracy
  • Compact modular design minimizes floor space requirements
  • Multi-chip processing capability supports 16 different chip types
  • Flexible operation with multiple carrier support
  • Deep cavity operation capability (up to 11mm)
  • High production efficiency with low operational costs
Technical Advantages
High precision linear motor system with ±10μm accuracy
High precision linear motor system with ±10μm accuracy
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 1
Supports 16 Waffle packs (2"x2" or 4"x4" sizes)
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 2
3μm accuracy height measurement with multiple probe options
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 3
Quick-change nozzle system with 7 station capacity
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 4
High-resolution 2448x2048 visual recognition system
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine 5
11mm maximum depth deep cavity operation
Dispensing Function Features
  • Compatible with various epoxy adhesive types
  • Flexible graphic dispensing capabilities
  • Includes standard graphics library
  • Supports custom graphic creation
Detailed Technical Parameters
Parameter Specification
Placement Accuracy ≤±10um@3σ
Placement Angle Accuracy ±0.15°@3σ
Force Control Range 20~1000g (configurable up to 7500g)
Force Control Accuracy 20g-150g:±2g@3σ; 150g-1000g:±5%@3σ
IC Dimensions L0.25×W0.25 to L10×W10 mm
Loading/Unloading Manual or automatic options
Bottom Photo-taking Equipped with camera
Installation Requirements
1. Leakage protection switch: ≥100ma
2. Compressed air: 0.4-0.6Mpa (Ø10mm inlet pipe)
3. Vacuum requirement: <-88kPa (Ø10mm inlet pipe, 2 tracheal joints)
4. Power: AC220V, 50/60Hz (≥2.5mm² three-core power copper wire, 50A leakage protection switch)
5. Floor loading capacity: ≥800kg/m²
Tags: 

die bonding machine  

automatic die bonder  

chip bonding machine

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