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IC Bonding Machine

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

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Selective Wave Soldering Machine

SMT Peripheral Equipment

Ms. Yang

yanglin@suneast.com.cn

+86 13714780575

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High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Brand Name:	Suneast
Model Number:	CBD2200 EVO
MOQ:	≥1 pc
Price:	Negotiable
Packaging Details:	Plywood crate
Payment Terms:	T/T,

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen, Guangdong Province, China

Certification:

CE、ISO

Name:

IC Bonder

Model:

CBD2200 EVO

Machine Dimension:

1400(L)*1250(W)*1700(H)mm

Weight:

Approx.1500Kg

Placement Accuracy:

≤±10um@3σ

Placement Angle Accuracy:

±0.15°@3σ

Substrate Pallet Size:

L200 X W90~150mm

Core Module Movement Mode:

Linear Motor + Grating Scale

Glue Feeding Mode:

Dispensing + Painting Glue

Customizable:

Highlight:

spring motor ce iso magnetic

motor iso magnetic spring ce

selective wave solder multi module combined

Product Description

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Product Overview

The CBD2200 EVO IC Bonder is a high-speed, precision modular platform designed for efficient semiconductor packaging with minimal floor space requirements.

Key Specifications

Attribute	Value
Model	CBD2200 EVO
Machine Dimensions	1400(L) × 1250(W) × 1700(H) mm
Weight	Approx. 1500Kg
Placement Accuracy	≤±10um@3σ
Placement Angle Accuracy	±0.15°@3σ
Substrate Pallet Size	L200 × W90~150mm
Movement Mode	Linear motor + grating scale
Glue Feeding Mode	Dispensing + painting glue
Customization	Available

Product Features

High-speed operation with ±10um@3σ placement accuracy
Compact modular design minimizes floor space requirements
Multi-chip processing capability supports 16 different chip types
Flexible operation with multiple carrier support
Deep cavity operation capability (up to 11mm)
High production efficiency with low operational costs

Technical Advantages

High precision linear motor system with ±10μm accuracy

Supports 16 Waffle packs (2"x2" or 4"x4" sizes)

3μm accuracy height measurement with multiple probe options

Quick-change nozzle system with 7 station capacity

High-resolution 2448x2048 visual recognition system

11mm maximum depth deep cavity operation

Dispensing Function Features

Compatible with various epoxy adhesive types
Flexible graphic dispensing capabilities
Includes standard graphics library
Supports custom graphic creation

Detailed Technical Parameters

Parameter	Specification
Placement Accuracy	≤±10um@3σ
Placement Angle Accuracy	±0.15°@3σ
Force Control Range	20~1000g (configurable up to 7500g)
Force Control Accuracy	20g-150g:±2g@3σ; 150g-1000g:±5%@3σ
IC Dimensions	L0.25×W0.25 to L10×W10 mm
Loading/Unloading	Manual or automatic options
Bottom Photo-taking	Equipped with camera

Installation Requirements

1. Leakage protection switch: ≥100ma

2. Compressed air: 0.4-0.6Mpa (Ø10mm inlet pipe)

3. Vacuum requirement: <-88kPa (Ø10mm inlet pipe, 2 tracheal joints)

4. Power: AC220V, 50/60Hz (≥2.5mm² three-core power copper wire, 50A leakage protection switch)

5. Floor loading capacity: ≥800kg/m²

Tags:

Products Details

Home > Products >

IC Bonding Machine

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

All Category

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Brand Name:	Suneast
Model Number:	CBD2200 EVO
MOQ:	≥1 pc
Price:	Negotiable
Packaging Details:	Plywood crate
Payment Terms:	T/T,

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen, Guangdong Province, China

Brand Name:

Suneast

Certification:

CE、ISO

Model Number:

CBD2200 EVO

Name:

IC Bonder

Model:

CBD2200 EVO

Machine Dimension:

1400(L)*1250(W)*1700(H)mm

Weight:

Approx.1500Kg

Placement Accuracy:

≤±10um@3σ

Placement Angle Accuracy:

±0.15°@3σ

Substrate Pallet Size:

L200 X W90~150mm

Core Module Movement Mode:

Linear Motor + Grating Scale

Glue Feeding Mode:

Dispensing + Painting Glue

Customizable:

Yes

Minimum Order Quantity:

≥1 pc

Price:

Negotiable

Packaging Details:

Plywood crate

Delivery Time:

25~50 days

Payment Terms:

T/T,

Highlight:

spring motor ce iso magnetic

motor iso magnetic spring ce

selective wave solder multi module combined

Product Description

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

Product Overview

The CBD2200 EVO IC Bonder is a high-speed, precision modular platform designed for efficient semiconductor packaging with minimal floor space requirements.

Key Specifications

Attribute	Value
Model	CBD2200 EVO
Machine Dimensions	1400(L) × 1250(W) × 1700(H) mm
Weight	Approx. 1500Kg
Placement Accuracy	≤±10um@3σ
Placement Angle Accuracy	±0.15°@3σ
Substrate Pallet Size	L200 × W90~150mm
Movement Mode	Linear motor + grating scale
Glue Feeding Mode	Dispensing + painting glue
Customization	Available

Product Features

High-speed operation with ±10um@3σ placement accuracy
Compact modular design minimizes floor space requirements
Multi-chip processing capability supports 16 different chip types
Flexible operation with multiple carrier support
Deep cavity operation capability (up to 11mm)
High production efficiency with low operational costs

Technical Advantages

High precision linear motor system with ±10μm accuracy

Supports 16 Waffle packs (2"x2" or 4"x4" sizes)

3μm accuracy height measurement with multiple probe options

Quick-change nozzle system with 7 station capacity

High-resolution 2448x2048 visual recognition system

11mm maximum depth deep cavity operation

Dispensing Function Features

Compatible with various epoxy adhesive types
Flexible graphic dispensing capabilities
Includes standard graphics library
Supports custom graphic creation

Detailed Technical Parameters

Parameter	Specification
Placement Accuracy	≤±10um@3σ
Placement Angle Accuracy	±0.15°@3σ
Force Control Range	20~1000g (configurable up to 7500g)
Force Control Accuracy	20g-150g:±2g@3σ; 150g-1000g:±5%@3σ
IC Dimensions	L0.25×W0.25 to L10×W10 mm
Loading/Unloading	Manual or automatic options
Bottom Photo-taking	Equipped with camera

Installation Requirements

1. Leakage protection switch: ≥100ma

2. Compressed air: 0.4-0.6Mpa (Ø10mm inlet pipe)

3. Vacuum requirement: <-88kPa (Ø10mm inlet pipe, 2 tracheal joints)

4. Power: AC220V, 50/60Hz (≥2.5mm² three-core power copper wire, 50A leakage protection switch)

5. Floor loading capacity: ≥800kg/m²

Tags:

Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment

Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment

products details

Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

spring motor ce iso magnetic

motor iso magnetic spring ce

selective wave solder multi module combined

Products Details

Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment

High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine

spring motor ce iso magnetic

motor iso magnetic spring ce

selective wave solder multi module combined