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IC Bonding Machine

Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine

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Selective Wave Soldering Machine

SMT Peripheral Equipment

Ms. Yang

yanglin@suneast.com.cn

+86 13714780575

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Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine

Brand Name:	Suneast
Model Number:	CBD2200
MOQ:	≥1 pc
Price:	Negotiable
Packaging Details:	Plywood crate
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen, Guangdong Province, China

Certification:

CE、ISO

Name:

IC Bonder

Model:

CBD2200

Machine Dimension:

1610(L)*1380(W)*1620(H)mm

Placement Accuracy:

±10um@3σ

Placement Angle Accuracy:

±0.3°@3σ

Die Size:

0.25*0.25mm-10*10mm

Substrate Size:

L300*W100

Placement Pressure:

30-500g

Glue Feeding Mode:

Dispensing, Dipping, Painting

Customizable:

Highlight:

wave soldering selective combined multi module

multi module combined wave soldering selective

multi module wave soldering selective combined

Product Description

Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine

Product Overview

The CBD2200 IC Bonder is a high-precision machine designed for small batch placement operations. It features automatic bonding head switching capability for handling chips with varying parameters.

Key Specifications

Model

CBD2200

Machine Dimensions

1610(L)×1380(W)×1620(H)mm

Placement Accuracy

±10um@3σ

Die Size Range

0.25×0.25mm to 10×10mm

Substrate Size

L300×W100

Placement Pressure

30-500g

Advanced Features

Supermini chip placement capability
Ultrathin die bonding technology
Automatic nozzle change system
Bottom photo-taking for high precision placement
Quick changeover between operations

Technical Specifications

Parameter	Specification
Placement Accuracy	±10um@3σ
Placement Angle Accuracy	±0.3°@3σ
Loading Mode	Wafer box
Placement Head	0-360° rotation/Auto change nozzle (option)
Core Motion Module	Linear motor + grating scale
Platform Base	Marble platform

Primary Applications

Ideal for small batch production of military RF products, power modules, and power amplifiers. Capable of automatically switching between various mounting heads to accommodate different chip parameters.

Operation Requirements

Leakage protection switch: ≥100ma
Compressed air: 0.4-0.6Mpa (Inlet pipe: Ø10mm)
Vacuum requirement: <-88kPa (Inlet pipe: Ø10mm)
Power: AC220V, 50/60HZ (Three core power copper wire ≥2.5mm²)
Ground requirement: Must withstand 800kg/m² pressure

Tags:

Products Details

Home > Products >

IC Bonding Machine

Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine

All Category

Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine

Brand Name:	Suneast
Model Number:	CBD2200
MOQ:	≥1 pc
Price:	Negotiable
Packaging Details:	Plywood crate
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen, Guangdong Province, China

Brand Name:

Suneast

Certification:

CE、ISO

Model Number:

CBD2200

Name:

IC Bonder

Model:

CBD2200

Machine Dimension:

1610(L)*1380(W)*1620(H)mm

Placement Accuracy:

±10um@3σ

Placement Angle Accuracy:

±0.3°@3σ

Die Size:

0.25*0.25mm-10*10mm

Substrate Size:

L300*W100

Placement Pressure:

30-500g

Glue Feeding Mode:

Dispensing, Dipping, Painting

Customizable:

Yes

Minimum Order Quantity:

≥1 pc

Price:

Negotiable

Packaging Details:

Plywood crate

Delivery Time:

25~50 days

Payment Terms:

T/T

Highlight:

wave soldering selective combined multi module

multi module combined wave soldering selective

multi module wave soldering selective combined

Product Description

Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine

Product Overview

The CBD2200 IC Bonder is a high-precision machine designed for small batch placement operations. It features automatic bonding head switching capability for handling chips with varying parameters.

Key Specifications

Model

CBD2200

Machine Dimensions

1610(L)×1380(W)×1620(H)mm

Placement Accuracy

±10um@3σ

Die Size Range

0.25×0.25mm to 10×10mm

Substrate Size

L300×W100

Placement Pressure

30-500g

Advanced Features

Supermini chip placement capability
Ultrathin die bonding technology
Automatic nozzle change system
Bottom photo-taking for high precision placement
Quick changeover between operations

Technical Specifications

Parameter	Specification
Placement Accuracy	±10um@3σ
Placement Angle Accuracy	±0.3°@3σ
Loading Mode	Wafer box
Placement Head	0-360° rotation/Auto change nozzle (option)
Core Motion Module	Linear motor + grating scale
Platform Base	Marble platform

Primary Applications

Operation Requirements

Leakage protection switch: ≥100ma
Compressed air: 0.4-0.6Mpa (Inlet pipe: Ø10mm)
Vacuum requirement: <-88kPa (Inlet pipe: Ø10mm)
Power: AC220V, 50/60HZ (Three core power copper wire ≥2.5mm²)
Ground requirement: Must withstand 800kg/m² pressure

Tags:

Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment

Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment

products details

Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment

Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine

wave soldering selective combined multi module

multi module combined wave soldering selective

multi module wave soldering selective combined

Products Details

Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment

Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine

wave soldering selective combined multi module

multi module combined wave soldering selective

multi module wave soldering selective combined