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Selective Wave Soldering Machine

PCB Automatic Selective Soldering System 30kw Select Solder Machine Single

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Selective Wave Soldering Machine

SMT Peripheral Equipment

Ms. Yang

yanglin@suneast.com.cn

+86 13714780575

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PCB Automatic Selective Soldering System 30kw Select Solder Machine Single

Brand Name:	Suneast
Model Number:	SUNFLOW 3/450
MOQ:	≥1 pc
Price:	Negotiable
Packaging Details:	Plywood crate
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen, Guangdong Province, China

Certification:

CE、ISO

Name:

Selective Soldering Machine

Model:

SUNFLOW 3/450

Dimension:

2710(L)*1930(W)*1630(H)mm

Weight:

1500kg

Max PCB Size:

510(L)*450(W)mm

Min PCB Size:

120(L)*50(W)mm

Air Input Pressure:

0.6Mpa

Required Purity Of Nitrogen:

>99.999%

Supply Voltage:

380VAC

Max Power Consumption:

<30kw

Max Soldering Temperature:

Customizable:

Highlight:

multi module Selective Soldering

multi module Selective Soldering System

multi module Selective Soldering Systems

Product Description

PCB Automatic Selective Soldering System 30kw Select Solder Machine Single

Product Specifications

Name	Selective Soldering Machine
Model	SUNFLOW 3/450
Dimension	2710(L)1930(W)1630(H)mm
Weight	1500kg
Max PCB size	510(L)*450(W)mm
Min PCB size	120(L)*50(W)mm
Air Input Pressure	0.6Mpa
Required Purity of Nitrogen	>99.999%
Supply Voltage	380VAC
Max Power Consumption	<30kw
Max soldering temperature	330℃
Customizable	Yes

Product Overview

The Selective Solder Machine Single With Electromagnetic Pump SUNFLOW 3/450 is a specialized wave soldering system designed for PCB plug-in through-hole soldering applications. This advanced system consists of three key modules: flux spraying, preheating, and soldering, all operating according to pre-programmed instructions for precise, targeted soldering.

Key Features

Independent R&D electromagnetic pump technology
Hybrid chain and roller drive system for optimal transport
Automatic rail width adjustment system
High precision spray nozzle with 130μm diameter
Combination bottom side infrared and top side hot air preheating
Flexible online/offline programming options
Individual solder joint parameter settings
Real-time welding status monitoring
Expandable to dual electromagnetic pump configuration

Soldering Process

PCB is transported to flux module
Spray head moves to programmed area, applying flux only to designated solder joints
Top-side and bottom-side preheating occurs
Electromagnetic pump performs precise soldering
Completed PCB is transported out

Core Machine Modules

Flux Application Module
Preheat Module
Soldering Module
Conveyor System

Advanced System Capabilities

Programming Flexibility: Multiple programming options with individual parameters for each solder point, offline programming capability, and process data recording.

Precision Transport: Hybrid conveyor system combines chain transport in flux/preheat modules with roller transport in soldering module for optimal positioning accuracy.

Flux Efficiency: Precision drop nozzle minimizes spray area to 3mm, reducing flux consumption by 90% compared to conventional methods.

Thermal Management: Dual heating system combines top convection and bottom IR heating for uniform temperature distribution across multi-layer boards.

Soldering Quality: Electromagnetic pump ensures stable wave height with quick-change solder nozzles and minimal maintenance requirements.

Available Options

Automatic Tinning: Supports 2mm diameter tin wire with adjustable addition frequency and time settings
Automatic Cleaning: Powder cleaning method with customizable location, frequency, and duration settings
Fiducial Recognition: High definition camera system with multiple image recognition modes

Technical Specifications

Parameter	SUNFLOW 3/450	SUNFLOW 3/610
General Parameters
Overall dimension (mm)	2710(L)1930(W)1630(H)	3040(L)2240(W)1630(H)
Equipment Weight (kg)	1550	2000
Max PCB size (mm)	510(L)*450(W)	610(L)*610(W)
Min PCB size (mm)	120(L)*50(W)	120(L)*50(W)
PCB Top Side Clearance (mm)	120	120
PCB Bottom Side Clearance (mm)	60	60
PCB process edge (mm)	≥3	≥3
Conveyor Height From Floor (mm)	900±20	900±20
PCB Conveying Speed (m/min)	0.2-10	0.2-10
Max PCB Weight (kg)	≤8	≤8
PCB Thickness With Jig (mm)	1-6	1-6
Conveyor Width Adjustment Range (mm)	50-450	50-610
Conveyor Width Adjustment Mode	Electric	Electric
PCB Conveying Direction	Left to right	Left to right
Air Input Pressure (Mpa)	0.6	0.6
Nitrogen Supply	Provided by customer
Nitrogen Input Pressure (Mpa)	0.6	0.6
Nitrogen Consumption (m³/h)	1.5	1.5
Required Purity of Nitrogen (%)	＞99.999	＞99.999
Supply Voltage (VAC)	380	380
Frequency (HZ)	50/60	50/60
Max Power Consumption (kw)	＜30	＜36
Max Current (A)	＜56	＜61
Ambient Temperature (℃)	10-35	10-35
Machine Noise Level (dB)	＜65	＜65
Communication Interface	SMEMA	SMEMA
Soldering System
Max. Soldering distance of X axis (mm)	510	610
Max. Soldering distance of Y axis (mm)	450	610
Max. Soldering distance of Z axis (mm)	60	60
Min outer diameter of nozzle (mm)	5.5	5.5
Nozzle inner diameter (mm)	2.5-10	2.5-10
Max soldering wave height (mm)	5	5
Solder pot capacity (kg)	Approx.13kg(Sn63Pb)/12kg(lead-free)	Approx.13kg(Sn63Pb)/12kg(lead-free)
Max soldering temperature (℃)	330	330
Soldering heating power (kw)	1.15	1.15
Preheating System
Preheat temperature range (℃)	＜200	＜200
Heating power (kw)	17	21.5
Heating mode	Hot air+Infrared	Hot air+Infrared
Top side preheating	Hot air	Hot air
Spraying System
Max. stroke of X axis (mm)	510	610
Max. stroke of Y axis (mm)	450	610
Spray height (mm)	60	60
Location speed (mm/s)	＜400	＜400
Spray head automatically cleaning	Program control	Program control
Flux box capacity (L)	2	2

Installation Requirements

Power Requirements:

Three phase five wire: voltage 380V, frequency 50/60HZ
Wire diameter requirement: 16mm²
Leakage protection switch: 125A with leakage capacity of 150-200mA

Ground Requirements: Must withstand pressure of 1000kg/m²

Ventilation Requirements:

Spray: Ø150mm duct with 150M³/H exhaust volume
Welding: Ø150mm duct with 150M³/H exhaust volume

Tags:

automatic selective soldering system

selective solder equipment

selective solder machine