products details

Home > Products >

Selective Wave Soldering Machine

Selective Solder Machine Hot Air With Dual Electromagnetic Pumps

All Category

Selective Wave Soldering Machine

SMT Peripheral Equipment

Ms. Yang

yanglin@suneast.com.cn

+86 13714780575

Contact Now

Selective Solder Machine Hot Air With Dual Electromagnetic Pumps

Brand Name:	Suneast
Model Number:	SUNFLOW DS/450Z
MOQ:	≥1 pc
Price:	Negotiable
Packaging Details:	Plywood crate
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen, Guangdong Province, China

Certification:

CE、ISO

Name:

Selective Soldering Machine

Model:

SUNFLOW DS/450Z

Dimension:

2710(L)*1930(W)*1630(H)mm

Equipment Weight:

1650kg

Max PCB Size:

510(L)*450(W)mm

Min PCB Size:

120(L)*50(W)mm

Required Purity Of Nitrogen:

≥99.999%

Max Power Consumption:

＜32kw

Max Soldering Temperature:

Heating Power:

Heating Mode:

Hotair+Infrared

Topside Preheating:

Hotair

Spray Height:

Customizable:

Highlight:

multi module Selective Solder Machine

Selective Solder multi module

Selective Solder machine multi module

Product Description

Selective Solder Machine Hot Air With Dual Electromagnetic Pumps

Product Overview

The SUNFLOW DS/450Z Selective Soldering Machine is a precision wave soldering system designed for PCB plug-in through-hole soldering applications. This advanced equipment features three key modules: flux spraying, preheating, and soldering, all controlled through pre-programmed operations.

Key Specifications

Attribute	Value
Model	SUNFLOW DS/450Z
Dimension	2710(L)1930(W)1630(H)mm
Equipment Weight	1650kg
PCB Size Range	120(L)50(W)mm to 510(L)450(W)mm
Max Power Consumption	＜32kw
Max Soldering Temperature	330℃
Heating Mode	Hotair+Infrared

Application Range

This selective wave soldering machine is ideal for high-end electronic products including:

Military aerospace components
Automotive electronics
Railway products
Switch power supplies

It meets the demanding through-hole soldering requirements of multi-layer PCBs with complex processes.

Key Features

High efficiency and energy saving design
Double solder pots with independent lifting
Real-time display and recording of welding status
Pioneering electromagnetic pump technology
Automatic nozzle spacing adjustment
Precision drop nozzle with 130μm diameter
Combined hot air and infrared preheating system

System Components

Flux Module
Preheat Module
Soldering Module
Conveyor System

Soldering Process

PCB is transported to flux module

Spray head moves to programmed area to apply flux

Top-side and bottom-side preheating

Programmed electromagnetic pump creates perfect solder joint

PCB is transported out

Technical Specifications

General Parameters

Parameter	SUNFLOW DS/450Z	SUNFLOW DS/610Z
Overall dimension (mm)	2710(L)1930(W)1630(H)	3040(L)2240(W)1630(H)
Equipment Weight (kg)	1650	2200
Max PCB size (mm)	510(L)*450(W)	610(L)*610(W)
Min PCB size (mm)	120(L)*50(W)	120(L)*50(W)
Max Power Consumption (kw)	＜32	＜38

Soldering System

Parameter	SUNFLOW DS/450Z	SUNFLOW DS/610Z
Max. Soldering distance of X axis (mm)	510	610
Max soldering temperature (℃)	330	330
Solder pot capacity (kg)	Approx.13kg(Sn63Pb)/solder pot	Approx.13kg(Sn63Pb)/solder pot

Important Notices

1. Power requirements: Three phase five wire: voltage 380V, frequency 50/60HZ; wire diameter requirement is 16mm².

2. The ground is required to withstand a pressure of 1000kg/m².

3. External ventilation requirements: Duct specification Ø150mm with exhaust volume 150M³/H for both spray and welding areas.

Tags:

automatic selective soldering system

selective solder equipment