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Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment

Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment

Brand Name: Suneast
Model Number: E-FLOW
MOQ: ≥1 pc
Price: Negotiable
Packaging Details: Plywood crate
Payment Terms: T/T
Detail Information
Place of Origin:
Shenzhen, Guangdong Province, China
Certification:
CE、ISO
Name:
Wave Soldering Machine
Model:
E-FLOW-350
Dimension:
4350(L)*1420(W)*1750(H)mm
Weight:
Approx.1600kg
Power Supply:
3PH 380V 50HZ
Running Power:
Approx.8KW
Control System:
PC+PLC
Solder Pot Heating Power:
13.5KW
Max Solder Pot Temperature:
300℃
Preheating Zone Number:
3
Exhausting:
Top Exhaust
Customizable:
Yes
Highlight:

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Product Description
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment
Product Specifications
Name Wave Soldering Machine
Model E-FLOW-350
Dimension 4350(L)*1420(W)*1750(H)mm
Weight Approx.1600kg
Power Supply 3PH 380V 50HZ
Running Power Approx.8KW
Control System PC+PLC
Solder Pot Heating Power 13.5KW
Max Solder Pot Temperature 300℃
Preheating Zone Number 3
Exhausting Top exhaust
Customizable Yes
Product Overview

E-FLOW Series Flexible Modular Lead-free Wave Soldering Machine features four major improvements for enhanced performance and durability:

Key Improvements
  • Conveyor system: Anti-wearing material structure for extended operational lifetime
  • Preheating system: Optimized hot air circulation for stable, even temperature distribution
  • Exhausting system: Innovative separate design for easier maintenance
  • Built-in selective spraying unit (option): Synchronous belt, ball screw, and linear guide rail system for precise X/Y direction movement with step motor control
Advanced Features
  • Conveying system: Direct buffering structure with special stainless steel chain and aluminum alloy rail design
  • Preheating system: Drawer-type module with energy-saving design, infrared/hot air convection combination, ±2℃ temperature control accuracy
  • Flux system: Precision control valve for digital regulation, stepping motor nozzle control, automatic pressure supply
  • Solder pot: Cast iron construction with anti-corrosion ceramic coating and dual low flow rate nozzles
  • Cooling system: Adjustable air cooling rate of 4-6℃/s
  • Control system: PC+PLC with Windows 10 interface, Chinese/English operation, auto-saving profiles and data
Applications

Wave soldering equipment is essential for soldering through-hole components on printed circuit boards across multiple industries including:

  • Consumer electronics
  • Communication equipment
  • Automotive electronics
  • Medical equipment
  • Industrial automation
  • Energy systems
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment 0
E-FLOW Series Wave Soldering Machine
System Components
  • 01 LCD
  • 02 Buffer system
  • 03 Auto-supplying Flux system
  • 04 Exhaust fan
  • 05 Flux spraying system
  • 06 Pre-heater
  • 07 Solder pot lifting unit
  • 08 Dual wave solder pot
  • 09 Cooling system
  • 10 Angle adjustment controller
  • 11 Finger cleaning system
  • 12 Conveyor system
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment 1
Built-in selective spraying device (Option)
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment 2
Top exhausting and filtering system
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment 3
Forced cooling system
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment 4
Lead-free processing nozzle
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment 5
Flexible preheating system combination
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment 6
Heavy-duty conveying system
Technical Parameters
Parameter E-FLOW E-FLOW-450 E-FLOW-610
Dimension (LxWxH) 4350x1420x1750mm 4350x1520x1750mm 4350x1690x1750mm
Weight Approx.1600kg Approx.1750kg Approx.1950kg
Power Supply 3PH 380V 50HZ 3PH 380V 50HZ 3PH 380V 50HZ
Operation Power Approx.8KW Approx.8.5KW Approx.11KW
Preheating Zones 3 3 3
PCB Width 50-350mm 50-450mm 50-610mm
Solder Pot Capacity Approx.480kg Approx.550kg Approx.640kg
Installation Requirements

Power requirements:

  • Three phase five wire: voltage 380V, frequency 50/60HZ
  • Wire diameter requirement: 16mm² with 125A leakage protection switch (150-200mA capacity)

Ground requirements: Must withstand pressure of 1000kg/m²

External air exhaust requirements:

  • Spray: air duct Ø250mm, exhaust air volume 30M³/min
  • Tin furnace outlet Ø250 and tail cover outlet Ø150 exhaust air volume: about 15M³/min
Good price  online

Products Details

Home > Products >
Wave Soldering Machines
>
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment

Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment

Brand Name: Suneast
Model Number: E-FLOW
MOQ: ≥1 pc
Price: Negotiable
Packaging Details: Plywood crate
Payment Terms: T/T
Detail Information
Place of Origin:
Shenzhen, Guangdong Province, China
Brand Name:
Suneast
Certification:
CE、ISO
Model Number:
E-FLOW
Name:
Wave Soldering Machine
Model:
E-FLOW-350
Dimension:
4350(L)*1420(W)*1750(H)mm
Weight:
Approx.1600kg
Power Supply:
3PH 380V 50HZ
Running Power:
Approx.8KW
Control System:
PC+PLC
Solder Pot Heating Power:
13.5KW
Max Solder Pot Temperature:
300℃
Preheating Zone Number:
3
Exhausting:
Top Exhaust
Customizable:
Yes
Minimum Order Quantity:
≥1 pc
Price:
Negotiable
Packaging Details:
Plywood crate
Delivery Time:
25~50 days
Payment Terms:
T/T
Highlight:

Selective solder machine multi module

,

multi module Selective solder machines

,

Selective solder machines multi module

Product Description
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment
Product Specifications
Name Wave Soldering Machine
Model E-FLOW-350
Dimension 4350(L)*1420(W)*1750(H)mm
Weight Approx.1600kg
Power Supply 3PH 380V 50HZ
Running Power Approx.8KW
Control System PC+PLC
Solder Pot Heating Power 13.5KW
Max Solder Pot Temperature 300℃
Preheating Zone Number 3
Exhausting Top exhaust
Customizable Yes
Product Overview

E-FLOW Series Flexible Modular Lead-free Wave Soldering Machine features four major improvements for enhanced performance and durability:

Key Improvements
  • Conveyor system: Anti-wearing material structure for extended operational lifetime
  • Preheating system: Optimized hot air circulation for stable, even temperature distribution
  • Exhausting system: Innovative separate design for easier maintenance
  • Built-in selective spraying unit (option): Synchronous belt, ball screw, and linear guide rail system for precise X/Y direction movement with step motor control
Advanced Features
  • Conveying system: Direct buffering structure with special stainless steel chain and aluminum alloy rail design
  • Preheating system: Drawer-type module with energy-saving design, infrared/hot air convection combination, ±2℃ temperature control accuracy
  • Flux system: Precision control valve for digital regulation, stepping motor nozzle control, automatic pressure supply
  • Solder pot: Cast iron construction with anti-corrosion ceramic coating and dual low flow rate nozzles
  • Cooling system: Adjustable air cooling rate of 4-6℃/s
  • Control system: PC+PLC with Windows 10 interface, Chinese/English operation, auto-saving profiles and data
Applications

Wave soldering equipment is essential for soldering through-hole components on printed circuit boards across multiple industries including:

  • Consumer electronics
  • Communication equipment
  • Automotive electronics
  • Medical equipment
  • Industrial automation
  • Energy systems
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment 0
E-FLOW Series Wave Soldering Machine
System Components
  • 01 LCD
  • 02 Buffer system
  • 03 Auto-supplying Flux system
  • 04 Exhaust fan
  • 05 Flux spraying system
  • 06 Pre-heater
  • 07 Solder pot lifting unit
  • 08 Dual wave solder pot
  • 09 Cooling system
  • 10 Angle adjustment controller
  • 11 Finger cleaning system
  • 12 Conveyor system
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment 1
Built-in selective spraying device (Option)
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment 2
Top exhausting and filtering system
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment 3
Forced cooling system
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment 4
Lead-free processing nozzle
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment 5
Flexible preheating system combination
Flexible Modular Mini Wave Soldering Lead Free Wave Soldering Equipment 6
Heavy-duty conveying system
Technical Parameters
Parameter E-FLOW E-FLOW-450 E-FLOW-610
Dimension (LxWxH) 4350x1420x1750mm 4350x1520x1750mm 4350x1690x1750mm
Weight Approx.1600kg Approx.1750kg Approx.1950kg
Power Supply 3PH 380V 50HZ 3PH 380V 50HZ 3PH 380V 50HZ
Operation Power Approx.8KW Approx.8.5KW Approx.11KW
Preheating Zones 3 3 3
PCB Width 50-350mm 50-450mm 50-610mm
Solder Pot Capacity Approx.480kg Approx.550kg Approx.640kg
Installation Requirements

Power requirements:

  • Three phase five wire: voltage 380V, frequency 50/60HZ
  • Wire diameter requirement: 16mm² with 125A leakage protection switch (150-200mA capacity)

Ground requirements: Must withstand pressure of 1000kg/m²

External air exhaust requirements:

  • Spray: air duct Ø250mm, exhaust air volume 30M³/min
  • Tin furnace outlet Ø250 and tail cover outlet Ø150 exhaust air volume: about 15M³/min