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Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer

Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer

Brand Name: Suneast
Model Number: SEMI-E3
MOQ: ≥1 pc
Price: Negotiable
Packaging Details: Plywood crate
Payment Terms: T/T
Detail Information
Place of Origin:
Shenzhen, Guangdong Province, China
Certification:
CE、ISO
Name:
Semiconductor Printer
Repeat Position Accuracy:
± 8um@6σ,CPK≥2.0
Repeat Print Accuracy:
±15um@6σ,CPK≥2.0
Laminate Thickness:
0.5-2mm
Transmission Height:
900±40mm
Transmission Speed:
1500mm/s(max)
Laminate Support Method:
Vacuum Platform
Printing Speed:
10-200mm/sec
Stripper Distance:
0~20mm
Stripper Speed:
0-20mm/sec
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Product Description
Gold/Silver Paste Fully Automatic Semiconductor Printer
Product Overview

This fully automatic semiconductor printer utilizes screen printing technology to apply conductor paste, resistor paste, or dielectric paste onto ceramic substrates. After high-temperature sintering, these materials form a firmly adhered film, enabling the creation of multi-layer interconnected circuits containing resistors or capacitors through repeated printing.

Key Specifications
Repeat Position Accuracy ± 8um@6σ,CPK≥2.0
Repeat Print Accuracy ±15um@6σ,CPK≥2.0
Laminate Thickness 0.5-2mm
Transmission Speed 1500mm/s(max)
Printing Speed 10-200mm/sec
Film Thickness Accuracy ±1um
Applications

The SEMI-E3 semiconductor printer is designed for precision printing in manufacturing processes for:

  • Semiconductor devices and thermal print heads
  • Ceramic capacitors, circuits, and filters
  • Potentiometers, dielectric antennas, and RFID components
  • LTCC, MLCC, and piezoelectric ceramic components
  • Various sensors and chip components
Advanced Features
  • Ergonomic Design: Modern, stable structure meeting human engineering standards
  • Smart Control: SPI online function for material replacement and quality control
  • User-Friendly Interface: Bilingual (Chinese/English) software with intuitive operation
  • Precision Optical System: Enhanced MARK recognition with traceability features
  • Dust-Proof Construction: Suitable for thousand-level cleanliness environments
  • High Accuracy: Film thickness consistency guaranteed to ±1 micron
Technical Modules
Substrate Positioning Module
  • Full servo UVW module with advanced calibration algorithm
  • High-precision vacuum adsorption and support mechanism
  • Vacuum negative pressure monitoring and breaking functions
Robot Handling Module
  • Reduces substrate contamination in high-cleanliness environments
  • Three-stage track conveying mechanism improves efficiency
CCD Vision Module
  • Gantry dual-drive motion structure for uniform force distribution
  • Linear motor drives for enhanced positioning accuracy
Squeegee Printing Module
  • Adjustable screen frame arm with scale for fast setup
  • Specialized one-lay one-scrape squeegee with Y-direction adjustment
  • Innovative long-side printing method improves force uniformity
Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer 0
Complete Technical Parameters
Parameter Category Specifications
Machine Performance

Repeat Position Accuracy: ±8um@6σ,CPK≥2.0

Printing film thickness accuracy: ±1um

Processing CT: 4min

Substrate Processing

Maximum Laminate Dimension: Standard 270*70mm (Customizable)

Transmission Speed: 1500mm/s(max)

Laminate Support Method: Vacuum platform

Printing Parameters

Printing Speed: 10-200mm/sec

Printing Pressure Control: 0.5~20Kg

Stripper Speed: 0-20mm/sec

Machine Specifications

Power Requirement: AC220±10%, 2.2KW

Machine Weight: About 900Kg

Dimensions: 1140mm(L) × 1155mm(W) × 1665mm(H)

Good price  online

Products Details

Home > Products >
Solder Paste Printer
>
Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer

Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer

Brand Name: Suneast
Model Number: SEMI-E3
MOQ: ≥1 pc
Price: Negotiable
Packaging Details: Plywood crate
Payment Terms: T/T
Detail Information
Place of Origin:
Shenzhen, Guangdong Province, China
Brand Name:
Suneast
Certification:
CE、ISO
Model Number:
SEMI-E3
Name:
Semiconductor Printer
Repeat Position Accuracy:
± 8um@6σ,CPK≥2.0
Repeat Print Accuracy:
±15um@6σ,CPK≥2.0
Laminate Thickness:
0.5-2mm
Transmission Height:
900±40mm
Transmission Speed:
1500mm/s(max)
Laminate Support Method:
Vacuum Platform
Printing Speed:
10-200mm/sec
Stripper Distance:
0~20mm
Stripper Speed:
0-20mm/sec
Minimum Order Quantity:
≥1 pc
Price:
Negotiable
Packaging Details:
Plywood crate
Delivery Time:
25~50 days
Payment Terms:
T/T
Highlight:

combined wave solder selective multi module

,

selective combined wave solder multi module

,

multi module wave solder selective combined

Product Description
Gold/Silver Paste Fully Automatic Semiconductor Printer
Product Overview

This fully automatic semiconductor printer utilizes screen printing technology to apply conductor paste, resistor paste, or dielectric paste onto ceramic substrates. After high-temperature sintering, these materials form a firmly adhered film, enabling the creation of multi-layer interconnected circuits containing resistors or capacitors through repeated printing.

Key Specifications
Repeat Position Accuracy ± 8um@6σ,CPK≥2.0
Repeat Print Accuracy ±15um@6σ,CPK≥2.0
Laminate Thickness 0.5-2mm
Transmission Speed 1500mm/s(max)
Printing Speed 10-200mm/sec
Film Thickness Accuracy ±1um
Applications

The SEMI-E3 semiconductor printer is designed for precision printing in manufacturing processes for:

  • Semiconductor devices and thermal print heads
  • Ceramic capacitors, circuits, and filters
  • Potentiometers, dielectric antennas, and RFID components
  • LTCC, MLCC, and piezoelectric ceramic components
  • Various sensors and chip components
Advanced Features
  • Ergonomic Design: Modern, stable structure meeting human engineering standards
  • Smart Control: SPI online function for material replacement and quality control
  • User-Friendly Interface: Bilingual (Chinese/English) software with intuitive operation
  • Precision Optical System: Enhanced MARK recognition with traceability features
  • Dust-Proof Construction: Suitable for thousand-level cleanliness environments
  • High Accuracy: Film thickness consistency guaranteed to ±1 micron
Technical Modules
Substrate Positioning Module
  • Full servo UVW module with advanced calibration algorithm
  • High-precision vacuum adsorption and support mechanism
  • Vacuum negative pressure monitoring and breaking functions
Robot Handling Module
  • Reduces substrate contamination in high-cleanliness environments
  • Three-stage track conveying mechanism improves efficiency
CCD Vision Module
  • Gantry dual-drive motion structure for uniform force distribution
  • Linear motor drives for enhanced positioning accuracy
Squeegee Printing Module
  • Adjustable screen frame arm with scale for fast setup
  • Specialized one-lay one-scrape squeegee with Y-direction adjustment
  • Innovative long-side printing method improves force uniformity
Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer 0
Complete Technical Parameters
Parameter Category Specifications
Machine Performance

Repeat Position Accuracy: ±8um@6σ,CPK≥2.0

Printing film thickness accuracy: ±1um

Processing CT: 4min

Substrate Processing

Maximum Laminate Dimension: Standard 270*70mm (Customizable)

Transmission Speed: 1500mm/s(max)

Laminate Support Method: Vacuum platform

Printing Parameters

Printing Speed: 10-200mm/sec

Printing Pressure Control: 0.5~20Kg

Stripper Speed: 0-20mm/sec

Machine Specifications

Power Requirement: AC220±10%, 2.2KW

Machine Weight: About 900Kg

Dimensions: 1140mm(L) × 1155mm(W) × 1665mm(H)