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Reflow Soldering Oven

Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven

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Selective Wave Soldering Machine

SMT Peripheral Equipment

Ms. Yang

yanglin@suneast.com.cn

+86 13714780575

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Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven

Brand Name:	Suneast
Model Number:	SEMI-08N｜SEMI-10N｜SEMI-13N
MOQ:	≥1 pc
Price:	Negotiable
Packaging Details:	Plywood crate
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen, Guangdong Province, China

Certification:

CE、ISO

Name:

Reflow Soldering Oven

Model:

SEMI-08N

Dimension:

5680(L)*1710(W)*1650(H)mm

Weight:

2400-2600kg

Power:

AC3Ø 5W 380V 50/60HZ

Total Power:

Normal Consumption:

Control Type:

PC+PLC Control System

Temp Control Accuracy:

PCB Temp Deviation:

±1.5℃

Power Outage Protection:

Equipped With UPS

N2 Area:

Full Nitrogen Filling

Highlight:

combined multi module selective wave solderings

wave soldering combined multi module selective

multi module selective wave soldering combined

Product Description

Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven

Product Specifications

Attribute	Value
Name	Reflow Soldering Oven
Model	SEMI-08N
Dimension	5680(L)1710(W)1650(H)mm
Weight	2400-2600kg
Power	AC3Ø 5W 380V 50/60HZ
Total Power	70KW
Normal consumption	10KW
Control type	PC+PLC Control system
Temp Control accuracy	±1℃
PCB Temp Deviation	±1.5℃
Power Outage Protection	Equipped with UPS
N2 area	Full nitrogen filling

Product Overview

SEMI Series Modular Design Semiconductor Reflow Soldering Oven Hot Air System

Applications

The solder paste printed on convex metal surfaces reflows into balls to complete combination welding of tin balls and substrates
Connects chips to PCBs after placement, enabling chip packaging and integrated circuit manufacturing

Core Technology

Patented hot air system with efficient heat compensation and precise temperature control (±1℃)
Full-process nitrogen protection with independent nitrogen control in each temperature zone to prevent component oxidation
Low oxygen content control (50-200PPM) ensures excellent welding quality
Modular design with efficient cooling system (0.5-6℃/S cooling slope)
Fine mesh belt for smooth transmission of tiny components without falling
High-efficiency clean treatment meets semiconductor dust-free workshop requirements

Key Features

CONVEYOR SYSTEM

Special fine mesh belt transmission for semiconductor components, prevents falling and jamming

HOT AIR SYSTEM MULTI-FREQUENCY CONTROL

Multi-frequency converter control for precise temperature regulation and stable airflow

ROSIN RECOVERY SYSTEM

Independent recovery devices with multistage filtration at inlet, outlet, and preheating areas

FULL NITROGEN PROTECTION SYSTEM

Ultra-low oxygen environment (50PPM) with independent nitrogen control in each process section

LOW NITROGEN CONSUMPTION

Multi-layer heat insulation with closed-loop recovery system reduces nitrogen usage

EFFICIENT HOT AIR CIRCULATION

Multi-layer insulation design provides high thermal stability with low energy consumption

COOLING SYSTEM

High-power cold water system ensures optimal cooling slope (0.5-6℃/S)

CONTROL SYSTEM

Advanced temperature control meets semiconductor packaging heating requirements

HIGH CLEANLINESS

Thousand-level clean room meets semiconductor equipment requirements

SEMICONDUCTOR COMMUNICATION

SECS/GEM protocol support for smart factory integration and data collection

Technical Parameters

Parameter	Model
Parameter	SEMI-08N	SEMI-10N	SEMI-13N
Heating system
Heating zone structure	8 zones, 16 modules	10 zones, 20 modules	13 zones, 26 modules
Heating zone length	2950mm	3670mm	4750mm
Heating up time	20min	25min	25min
Outlet Exhaust Diameter/Volume	2-Ø145, Exhaust demand 10m³/min x2
Cooling system
Cooling type	Three cooling zones: forced water cooling
Cooling zone length	1250mm
Chiller power	External Water chiller (Optional: connected to customer workshop cooling water)
Conveyor system
Conveyor Type	Fine mesh mesh belt (Optional: B-shaped mesh belt, force bone mesh belt)
Conveyor Direction	L->R,R->L
Conveyor Height	900±20mm
Mesh belt width	24" (Other width sizes can be customized)
Component Height	20mm
Conveyor Speed	300mm-2000mm/min
Control system
Power	AC3Ø 5W 380V 50/60HZ
Total Power	70KW	89KW	118KW
Startup Power	35KW	38KW	42KW
Normal consumption	10KW	12KW	14KW
Temp Control Range	Room temperature to 320℃
Control type	PC+PLC Control system
Temp Control accuracy	±1℃
PCB Temp Deviation	±1.5℃
Data Storage	Process Data and status storage
Power Outage Protection	Equipped with UPS
Operation Interface	Windows Chinese simplified, English online free switching
N2 area	Full nitrogen filling
Secs/Gem communication protocol	Standard
MES communication protocol	Standard
Computer	Commercial computer
Machine Parameter
Dimension(LxWxH)	5680x1710x1650mm	6400x1710x1650mm	7500x1710x1650mm
Weight	2400-2600kg	3200-3400kg	3600-3800kg
Flux recovery system	Standard
Color	Bright wrinkled white

Installation Requirements

1. Power requirements: Three phase five wire: voltage 380V, frequency 50/60HZ; Wire diameter above 25mm², leakage protection switch 160A, leakage protection switch leakage capacity 150-200mA.

2. The ground is required to withstand a pressure of 1000kg/m²

3. External ventilation requirements: air duct Ø145mm, ventilation volume 15-20M³/min.

Tags:

Products Details

Home > Products >

Reflow Soldering Oven

Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven

All Category

Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven

Brand Name:	Suneast
Model Number:	SEMI-08N｜SEMI-10N｜SEMI-13N
MOQ:	≥1 pc
Price:	Negotiable
Packaging Details:	Plywood crate
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen, Guangdong Province, China

Brand Name:

Suneast

Certification:

CE、ISO

Model Number:

SEMI-08N｜SEMI-10N｜SEMI-13N

Name:

Reflow Soldering Oven

Model:

SEMI-08N

Dimension:

5680(L)*1710(W)*1650(H)mm

Weight:

2400-2600kg

Power:

AC3Ø 5W 380V 50/60HZ

Total Power:

70KW

Normal Consumption:

10KW

Control Type:

PC+PLC Control System

Temp Control Accuracy:

±1℃

PCB Temp Deviation:

±1.5℃

Power Outage Protection:

Equipped With UPS

N2 Area:

Full Nitrogen Filling

Minimum Order Quantity:

≥1 pc

Price:

Negotiable

Packaging Details:

Plywood crate

Delivery Time:

25~50 days

Payment Terms:

T/T

Highlight:

combined multi module selective wave solderings

wave soldering combined multi module selective

multi module selective wave soldering combined

Product Description

Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven

Product Specifications

Attribute	Value
Name	Reflow Soldering Oven
Model	SEMI-08N
Dimension	5680(L)1710(W)1650(H)mm
Weight	2400-2600kg
Power	AC3Ø 5W 380V 50/60HZ
Total Power	70KW
Normal consumption	10KW
Control type	PC+PLC Control system
Temp Control accuracy	±1℃
PCB Temp Deviation	±1.5℃
Power Outage Protection	Equipped with UPS
N2 area	Full nitrogen filling

Product Overview

SEMI Series Modular Design Semiconductor Reflow Soldering Oven Hot Air System

Applications

The solder paste printed on convex metal surfaces reflows into balls to complete combination welding of tin balls and substrates
Connects chips to PCBs after placement, enabling chip packaging and integrated circuit manufacturing

Core Technology

Patented hot air system with efficient heat compensation and precise temperature control (±1℃)
Full-process nitrogen protection with independent nitrogen control in each temperature zone to prevent component oxidation
Low oxygen content control (50-200PPM) ensures excellent welding quality
Modular design with efficient cooling system (0.5-6℃/S cooling slope)
Fine mesh belt for smooth transmission of tiny components without falling
High-efficiency clean treatment meets semiconductor dust-free workshop requirements

Key Features

CONVEYOR SYSTEM

Special fine mesh belt transmission for semiconductor components, prevents falling and jamming

HOT AIR SYSTEM MULTI-FREQUENCY CONTROL

Multi-frequency converter control for precise temperature regulation and stable airflow

ROSIN RECOVERY SYSTEM

Independent recovery devices with multistage filtration at inlet, outlet, and preheating areas

FULL NITROGEN PROTECTION SYSTEM

Ultra-low oxygen environment (50PPM) with independent nitrogen control in each process section

LOW NITROGEN CONSUMPTION

Multi-layer heat insulation with closed-loop recovery system reduces nitrogen usage

EFFICIENT HOT AIR CIRCULATION

Multi-layer insulation design provides high thermal stability with low energy consumption

COOLING SYSTEM

High-power cold water system ensures optimal cooling slope (0.5-6℃/S)

CONTROL SYSTEM

Advanced temperature control meets semiconductor packaging heating requirements

HIGH CLEANLINESS

Thousand-level clean room meets semiconductor equipment requirements

SEMICONDUCTOR COMMUNICATION

SECS/GEM protocol support for smart factory integration and data collection

Technical Parameters

Parameter	Model
Parameter	SEMI-08N	SEMI-10N	SEMI-13N
Heating system
Heating zone structure	8 zones, 16 modules	10 zones, 20 modules	13 zones, 26 modules
Heating zone length	2950mm	3670mm	4750mm
Heating up time	20min	25min	25min
Outlet Exhaust Diameter/Volume	2-Ø145, Exhaust demand 10m³/min x2
Cooling system
Cooling type	Three cooling zones: forced water cooling
Cooling zone length	1250mm
Chiller power	External Water chiller (Optional: connected to customer workshop cooling water)
Conveyor system
Conveyor Type	Fine mesh mesh belt (Optional: B-shaped mesh belt, force bone mesh belt)
Conveyor Direction	L->R,R->L
Conveyor Height	900±20mm
Mesh belt width	24" (Other width sizes can be customized)
Component Height	20mm
Conveyor Speed	300mm-2000mm/min
Control system
Power	AC3Ø 5W 380V 50/60HZ
Total Power	70KW	89KW	118KW
Startup Power	35KW	38KW	42KW
Normal consumption	10KW	12KW	14KW
Temp Control Range	Room temperature to 320℃
Control type	PC+PLC Control system
Temp Control accuracy	±1℃
PCB Temp Deviation	±1.5℃
Data Storage	Process Data and status storage
Power Outage Protection	Equipped with UPS
Operation Interface	Windows Chinese simplified, English online free switching
N2 area	Full nitrogen filling
Secs/Gem communication protocol	Standard
MES communication protocol	Standard
Computer	Commercial computer
Machine Parameter
Dimension(LxWxH)	5680x1710x1650mm	6400x1710x1650mm	7500x1710x1650mm
Weight	2400-2600kg	3200-3400kg	3600-3800kg
Flux recovery system	Standard
Color	Bright wrinkled white

Installation Requirements

1. Power requirements: Three phase five wire: voltage 380V, frequency 50/60HZ; Wire diameter above 25mm², leakage protection switch 160A, leakage protection switch leakage capacity 150-200mA.

2. The ground is required to withstand a pressure of 1000kg/m²

3. External ventilation requirements: air duct Ø145mm, ventilation volume 15-20M³/min.

Tags:

Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment

Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment

products details

Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment

Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven

combined multi module selective wave solderings

wave soldering combined multi module selective

multi module selective wave soldering combined

Products Details

Wave Soldering Machines

Reflow Soldering Oven

Selective Wave Soldering Machine

Vertical Curing Oven

Tunnel Ovens

Solder Paste Printer

IC Bonding Machine

Semiconductor Ovens

Linear Motor

SMT Peripheral Equipment

Semiconductor Reflow Soldering Machine 70KW PCB Soldering Oven

combined multi module selective wave solderings

wave soldering combined multi module selective

multi module selective wave soldering combined