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Semiconductor Oven SEO Series

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Ms. Yang

yanglin@suneast.com.cn

+86 13714780575

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Semiconductor Oven SEO Series

Brand Name:	Suneast
Model Number:	SEO-100N
MOQ:	≥1 pc
Price:	Negotiable
Packaging Details:	Plywood crate
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen, Guangdong Province, China

Certification:

CE、ISO

Name:

Semiconductor Oven

Model:

SEO-100N

Dimension:

1700(L)*1200(W)*1800(H)mm

Box Dimension:

700(L)*550(W)*(600*2)(H)mm

Weight:

500-800kg

Total Power:

Heating Power:

10KW*2

Working Voltage:

AC3Ø 5W 380V 50/60H

Temperature Accuracy:

±0.5℃

Temperature Operating Range:

Room Temperature+10℃~250℃

Temperature Control Mode:

PID Closed-loop Control+SSR Drive

Customizable:

Highlight:

multi module combined selective wave solder

spring linear motor iso magnetic

magnetic linear motor iso spring

Product Description

Semiconductor Oven SEO Series

Product Overview

The Semiconductor Oven SEO Series features high capacity PID adjustment with excellent air tightness for nitrogen-filled environments. Designed for semiconductor wafer curing, IC packages, and glass substrates, this oven delivers superior temperature uniformity and stability.

Key Specifications

Attribute	Value
Model	SEO-100N
Dimension	1700(L)1200(W)1800(H)mm
Weight	500-800kg
Total Power	21KW
Temperature Accuracy	±0.5℃
Temperature Range	Room temperature+10℃~250℃

Core Technology

Horizontal Air Recirculation: High capacity system ensures superior temperature uniformity
Fully Sealed Chamber: Stainless steel construction with excellent air tightness for nitrogen efficiency
High Temperature Motor: Long-axis motor with large turbine blades for stable high-temperature operation
Precision Control: PID adjustment with 0.5℃ accuracy and programmable process profiles
Cleanroom Compatibility: Meets thousand-grade cleanroom standards for semiconductor production
Oxygen Control: Dual channel analysis maintains oxygen content below 50PPM

System Features

Chamber Structure

Features upper and lower hot air circulation systems with adjustable airflow. Constructed with high-quality stainless steel and layered brackets for optimal space utilization.

Nitrogen System

Equipped with multiple flow meters and oxygen analyzers for real-time monitoring. Maintains oxygen content below 500PPM (option for 100PPM).

Cooling System

Water cooling with fin radiator blast technology reduces cooling time while preventing product damage from rapid temperature changes.

Safety Protection

Includes over-temperature protection, oxygen content monitoring, nitrogen pressure alarms, electronic safety locks, and emergency stop switch.

Performance Validation

Particle concentration ≤35,200 (0.5μm) meets thousand-class cleanroom standards.

High precision temperature control with PID regulation ensures uniform heat distribution.

Technical Parameters

Parameter	Specification
Box Dimension	700(L)550(W)(600*2)(H)mm
Working Mode	Two independent boxes (1-4 optional)
Temperature Uniformity	±1.5%℃ (no-load)
Heating Time	≤15min (200℃ no-load)
Cooling Rate	2-5℃/min
Cleanliness Class	Class 1000

Installation Requirements

Gas Source: Nitrogen purity 99.999% at 0.5-0.8Mpa

Power: 380V 50/60HZ three phase five wire with 25mm² cable

Environment: 5-40℃ temperature range, 20-95% relative humidity

Floor Load: Minimum 1000kg/m²

Tags:

vacuum chamber oven

hot air circulation oven

wafer baking oven