The modular Snap Curing Oven SEO-600N with remote monitoring and nitrogen control is designed for semiconductor packaging processes. This advanced system combines automatic temperature control, nitrogen protection, buffer cooling, and automatic loading/unloading functions to optimize post-Die Attach curing and bonding operations.

• Heating System: 6 independently controlled zones with single row matrix lead frame arrangement
• Conveyor System: Independent conveying with buffer section and automatic collecting mechanism
• Control System: PC+PLC with Windows interface, bilingual support, and remote monitoring
• Protection System: Comprehensive safety features including over-temperature protection and fault alarms
• Nitrogen System: Adjustable flow control with real-time consumption monitoring

• Single setup adjustment with parameter memory for repeat production
• High curing temperature capability up to 250℃
• Precise temperature control within ±5℃ deviation
• Comprehensive alarm system with software interface notifications
• Real-time temperature curve monitoring for all modules
• Gas flow and pressure visualization for easy data tracking

Features 6 independent heating zones with PID temperature control, contact heating modules for uniform surface temperature, nitrogen protection to reduce oxidation, and real-time temperature monitoring.

Incorporates separate conveying system with easy maintenance, buffer modules, and optional collecting mechanisms. Cable transfer mechanism minimizes contact area with lead frames for consistent heat conduction.

PC+PLC control with PID temperature regulation and SSR output. Includes multiple protection functions: overtemperature alarms, ground leakage circuit breakers, and overheating protection.

Real-time monitoring of pressure and flow with adjustable flowmeter. Ensures even nitrogen distribution throughout the oven chamber to prevent material oxidation.

Windows 10 compatible with WPF framework for enhanced UI. User-friendly interface with functional module organization and comprehensive production logging capabilities.

Temperature testing confirms ±3℃ accuracy within set ranges. Cleanliness testing demonstrates ≤35,200 particles (0.5μm diameter), meeting Class 1000 cleanroom standards.