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Company news about Suneast Technology semiconductor packaging equipment "Chip Bonder" successfully introduced to the market

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Ms. Yang
yanglin@suneast.com.cn
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Suneast Technology semiconductor packaging equipment "Chip Bonder" successfully introduced to the market

2025-12-18

Integrated circuit chip is the foundation and core of modern electronic information industry, which is widely used and has important strategic significance to economic construction and social development. With the continuous development of AI, Internet of Things, unmanned driving, 5G and other emerging markets, the chip industry will be the top priority of high-end manufacturing in the future, and also a new height of scientific and technological competition among countries.

The manufacturing process of chip products is very complex and needs to be carried out with highly sophisticated equipment. However, the technical requirements of chip manufacturing equipment are high, the manufacturing is difficult with high cost. At present, most of the equipment is still controlled by others and depends on imports. To realize the localization of high-end chip manufacturing equipment as soon as possible, and to get rid of the long-term dependence of China's chip manufacturing on imported equipment, is the unremitting pursuit and mission of domestic equipment enterprises!

latest company news about Suneast Technology semiconductor packaging equipment "Chip Bonder" successfully introduced to the market 0

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News Details
Home > News >

Company news about-Suneast Technology semiconductor packaging equipment "Chip Bonder" successfully introduced to the market

Events

News

Cases

Suneast Technology semiconductor packaging equipment "Chip Bonder" successfully introduced to the market

2025-12-18

Integrated circuit chip is the foundation and core of modern electronic information industry, which is widely used and has important strategic significance to economic construction and social development. With the continuous development of AI, Internet of Things, unmanned driving, 5G and other emerging markets, the chip industry will be the top priority of high-end manufacturing in the future, and also a new height of scientific and technological competition among countries.

The manufacturing process of chip products is very complex and needs to be carried out with highly sophisticated equipment. However, the technical requirements of chip manufacturing equipment are high, the manufacturing is difficult with high cost. At present, most of the equipment is still controlled by others and depends on imports. To realize the localization of high-end chip manufacturing equipment as soon as possible, and to get rid of the long-term dependence of China's chip manufacturing on imported equipment, is the unremitting pursuit and mission of domestic equipment enterprises!

latest company news about Suneast Technology semiconductor packaging equipment "Chip Bonder" successfully introduced to the market 0

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